High Output Power and Efficiency 300-GHz Band InP-Based MOS-HEMT Power Amplifiers With Composite-Channel and Double-Side Doping

IF 2.4 3区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Journal of the Electron Devices Society Pub Date : 2024-10-18 DOI:10.1109/JEDS.2024.3483305
Yusuke Kumazaki;Shiro Ozaki;Naoya Okamoto;Naoki Hara;Yasuhiro Nakasha;Masaru Sato;Toshihiro Ohki
{"title":"High Output Power and Efficiency 300-GHz Band InP-Based MOS-HEMT Power Amplifiers With Composite-Channel and Double-Side Doping","authors":"Yusuke Kumazaki;Shiro Ozaki;Naoya Okamoto;Naoki Hara;Yasuhiro Nakasha;Masaru Sato;Toshihiro Ohki","doi":"10.1109/JEDS.2024.3483305","DOIUrl":null,"url":null,"abstract":"This paper demonstrated high-output-power and high-efficiency power amplifier (PA) monolithic microwave-integrated circuit (MMIC) at 300-GHz band (252–296 GHz) with the use of InPbased metal–oxide–semiconductor high-electron-mobility transistors (HEMTs) with composite-channel (CC) and double-side-doping (DD) techniques. The CC-DD structure obtained high output current and low channel resistance due to the improved carrier density and mobility. W-band load-pull measurement revealed the drastically improved output power density of CC-DD structure compared with that of singlechannel DD structure. The 2-stage cascaded, 4-way, and 16-way PA-MMICs were designed based on stacked common-gate transistors with current reuse topology. The cascaded PA-MMIC exhibited a poweradded efficiency (PAE) of 7.8%, and the 16-way PA-MMIC exhibited an output power of 16.9 dBm. These values are the highest among all the values reported for the 300-GHz band PA-MMICs. The 4-way PA-MMIC achieved a high output power of 13.6–14.6 dBm and high PAE of 4.8%–6.3% simultaneously at the entire 300-GHz band.","PeriodicalId":13210,"journal":{"name":"IEEE Journal of the Electron Devices Society","volume":"12 ","pages":"965-973"},"PeriodicalIF":2.4000,"publicationDate":"2024-10-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10722855","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Journal of the Electron Devices Society","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10722855/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

This paper demonstrated high-output-power and high-efficiency power amplifier (PA) monolithic microwave-integrated circuit (MMIC) at 300-GHz band (252–296 GHz) with the use of InPbased metal–oxide–semiconductor high-electron-mobility transistors (HEMTs) with composite-channel (CC) and double-side-doping (DD) techniques. The CC-DD structure obtained high output current and low channel resistance due to the improved carrier density and mobility. W-band load-pull measurement revealed the drastically improved output power density of CC-DD structure compared with that of singlechannel DD structure. The 2-stage cascaded, 4-way, and 16-way PA-MMICs were designed based on stacked common-gate transistors with current reuse topology. The cascaded PA-MMIC exhibited a poweradded efficiency (PAE) of 7.8%, and the 16-way PA-MMIC exhibited an output power of 16.9 dBm. These values are the highest among all the values reported for the 300-GHz band PA-MMICs. The 4-way PA-MMIC achieved a high output power of 13.6–14.6 dBm and high PAE of 4.8%–6.3% simultaneously at the entire 300-GHz band.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
采用复合沟道和双面掺杂技术的高输出功率和效率 300-GHz 频带 InP 型 MOS-HEMT 功率放大器
本文利用 InP 基金属氧化物半导体高电子迁移率晶体管 (HEMT),采用复合沟道 (CC) 和双侧掺杂 (DD) 技术,演示了 300 GHz 频段(252-296 GHz)的高输出功率和高效功率放大器 (PA) 单片微波集成电路 (MMIC)。由于提高了载流子密度和迁移率,CC-DD 结构获得了高输出电流和低沟道电阻。W 波段负载拉动测量显示,与单通道 DD 结构相比,CC-DD 结构的输出功率密度大幅提高。基于电流重用拓扑结构的堆叠共门晶体管设计了 2 级级联、4 路和 16 路 PA-MMIC。级联 PA-MMIC 的功率附加效率 (PAE) 为 7.8%,16 路 PA-MMIC 的输出功率为 16.9 dBm。这些值是 300 GHz 频段 PA-MMIC 所有报告值中最高的。4 路 PA-MMIC 在整个 300-GHz 频段同时实现了 13.6-14.6 dBm 的高输出功率和 4.8%-6.3% 的高 PAE。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
IEEE Journal of the Electron Devices Society
IEEE Journal of the Electron Devices Society Biochemistry, Genetics and Molecular Biology-Biotechnology
CiteScore
5.20
自引率
4.30%
发文量
124
审稿时长
9 weeks
期刊介绍: The IEEE Journal of the Electron Devices Society (J-EDS) is an open-access, fully electronic scientific journal publishing papers ranging from fundamental to applied research that are scientifically rigorous and relevant to electron devices. The J-EDS publishes original and significant contributions relating to the theory, modelling, design, performance, and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanodevices, optoelectronics, photovoltaics, power IC''s, and micro-sensors. Tutorial and review papers on these subjects are, also, published. And, occasionally special issues with a collection of papers on particular areas in more depth and breadth are, also, published. J-EDS publishes all papers that are judged to be technically valid and original.
期刊最新文献
Realization of Pure Boron/Si Diodes Through a Two-Step Low-Temperature Growth in a Home-Built LP CVD System Power Spectral Density of Thermal Noise at High Frequencies in Thermal Conductance for Semiconductor Devices Measurement and Analysis of Multistate Ferroelectric Transistors in 28 nm CMOS Process Continuum Modeling of High-Field Transport in Semiconductors Research on 4H-SiC Photoconductive Semiconductor Switch Employing Composite Anti-Reflection Coating
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1