Tin Silver Alloy as a Biomaterial: Corrosion Characteristics and Cellular Behavior

IF 3.9 3区 医学 Q2 ENGINEERING, BIOMEDICAL Journal of biomedical materials research. Part A Pub Date : 2024-10-29 DOI:10.1002/jbm.a.37822
Charley M. Goodwin, Annsley O. Mace, Jeremy L. Gilbert
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Abstract

Tin-silver (Sn-Ag) has been used as a permanently implanted biomaterial within the Essure female sterilization device and in dental amalgams; however, little data exist for Sn-Ag's corrosion characteristics and/or cellular interactions. In this study, to assess its suitability as a degradable metallic biomaterial, 95–5 wt% Sn-Ag solder was subjected to corrosion testing including open circuit potential (OCP), electrochemical impedance spectroscopy (EIS), and anodic potentiodynamic polarization in phosphate-buffered saline (PBS) and cell culture media (with serum proteins) at room temperature (25°C) and body temperature (37°C). Cell culture studies were also performed. Mouse pre-osteoblast cells (MC3T3-E1) were cultured in media on Sn-Ag discs and monitored over 24 h at potentials below, around, or above Sn-Ag's breakdown potential, fixed, and then viewed using SEM. Separately, cells on tissue culture plastic were subjected to increasing concentrations of SnCl2 in media for 24 h before a live-dead imaging at each concentration to determine cell viability and area fraction covered when compared with a control well. The results show both passive (in PBS), with a breakdown potential of −250 mV versus Ag/AgCl and active polarization behavior (in AMEM with proteins). EIS results showed polarization resistance (R p ) in the 105 Ωcm2 range but decreased generally with increasing temperature (p < 0.05). Cells were well attached on Sn-Ag surfaces at OCP and below the breakdown potential, but when anodically polarized, cells reduced their spread area and became more spherical, indicating less viability. SnCl2 exhibited a dose-dependent killing effect on MC3T3 cells with a lethal dose for 50% of about 0.5 mM. The results of these experiments show that Sn-Ag alloys can be considered as degradable metallic biomaterials.

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作为生物材料的锡银合金:腐蚀特性与细胞行为
锡银(Sn-Ag)已被用作 Essure 女性绝育装置和牙科汞合金中永久植入的生物材料;然而,有关锡银的腐蚀特性和/或细胞相互作用的数据却很少。在本研究中,为了评估其作为可降解金属生物材料的适用性,对 95-5 wt% 锡-银焊料进行了腐蚀测试,包括在室温(25°C)和体温(37°C)下,在磷酸盐缓冲盐水(PBS)和细胞培养基(含血清蛋白)中进行开路电位(OCP)、电化学阻抗光谱(EIS)和阳极电位极化。还进行了细胞培养研究。在培养基中将小鼠前成骨细胞(MC3T3-E1)培养在锡银圆盘上,在低于、接近或高于锡银击穿电位的情况下进行 24 小时的监测,固定细胞,然后用扫描电镜观察。另外,将组织培养塑料上的细胞置于介质中浓度不断增加的 SnCl2 中培养 24 小时,然后在每种浓度下进行活体死亡成像,以确定细胞存活率以及与对照孔相比的覆盖面积。结果显示了被动极化行为(在 PBS 中)和主动极化行为(在含有蛋白质的 AMEM 中),前者对 Ag/AgCl 的击穿电位为 -250 mV。EIS 结果显示,极化电阻(Rp)在 105 Ωcm2 范围内,但随着温度的升高,极化电阻普遍下降(p 2 对 MC3T3 细胞有剂量依赖性杀伤作用,50% 的致死剂量约为 0.5 mM)。这些实验结果表明,锡银合金可被视为可降解的金属生物材料。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Journal of biomedical materials research. Part A
Journal of biomedical materials research. Part A 工程技术-材料科学:生物材料
CiteScore
10.40
自引率
2.00%
发文量
135
审稿时长
3.6 months
期刊介绍: The Journal of Biomedical Materials Research Part A is an international, interdisciplinary, English-language publication of original contributions concerning studies of the preparation, performance, and evaluation of biomaterials; the chemical, physical, toxicological, and mechanical behavior of materials in physiological environments; and the response of blood and tissues to biomaterials. The Journal publishes peer-reviewed articles on all relevant biomaterial topics including the science and technology of alloys,polymers, ceramics, and reprocessed animal and human tissues in surgery,dentistry, artificial organs, and other medical devices. The Journal also publishes articles in interdisciplinary areas such as tissue engineering and controlled release technology where biomaterials play a significant role in the performance of the medical device. The Journal of Biomedical Materials Research is the official journal of the Society for Biomaterials (USA), the Japanese Society for Biomaterials, the Australasian Society for Biomaterials, and the Korean Society for Biomaterials. Articles are welcomed from all scientists. Membership in the Society for Biomaterials is not a prerequisite for submission.
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