Challenges and solutions in Mist-CVD of Ga2O3 heteroepitaxial films

IF 4.2 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Materials Science in Semiconductor Processing Pub Date : 2024-10-31 DOI:10.1016/j.mssp.2024.109063
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Abstract

Mist chemical vapor deposition (mist-CVD) has recently attracted interest as a facile, cost-effective, environmentally friendly method for the deposition of Ga2O3 films. This paper addresses selected challenges and issues that hinder the fabrication of high-quality Ga2O3 epitaxial films. Based on numerical simulations of the gas flow we show that the use of a fan, introducing atmospheric air into the horizontal growth reactor, avoids the formation of vortices and mist velocity fluctuations, which develop when a conventional carrier gas delivery system is employed. We also demonstrate that the presence of organic ligands in Ga acetylacetonate results in undesirable contamination of Ga2O3 films by pyrolytic carbon, which strongly affects the optical and morphological properties and can lead to incorrect estimation of the optical band gap. Carbon contamination is shown to be reduced by increasing the growth temperature, by growing under oxygen-rich conditions, or by using carbon-free precursors such as GaCl3. We further experimentally prove that when the thickness of Ga2O3 increases, a multiphase epitaxial film forms, presumably due to enhanced thermal stress. Finally, we experimentally show that nonstoichiometric GaOxClyHz microparticles form on top of a Ga2O3 film in the reactor zone, where the aerosol is completely evaporated and a vapor ambient is formed.
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Ga2O3 异质外延薄膜的雾化-气相沉积过程中的挑战和解决方案
雾状化学气相沉积(mist-CVD)作为一种简便、经济、环保的 Ga2O3 薄膜沉积方法,最近引起了人们的兴趣。本文探讨了阻碍制造高质量 Ga2O3 外延薄膜的一些挑战和问题。根据气流的数值模拟,我们发现使用风扇将大气中的空气引入水平生长反应器,可避免形成涡流和雾状速度波动,而在使用传统载气输送系统时会出现这种情况。我们还证明,乙酰丙酮酸镓中有机配位体的存在会导致热解碳对 Ga2O3 薄膜造成不良污染,从而严重影响光学和形态特性,并可能导致对光带隙的错误估计。事实证明,通过提高生长温度、在富氧条件下生长或使用无碳前驱体(如 GaCl3),可以减少碳污染。我们进一步通过实验证明,当 Ga2O3 的厚度增加时,会形成多相外延薄膜,这可能是由于热应力增强所致。最后,我们通过实验证明,在反应器区的 Ga2O3 薄膜顶部会形成非全度的 GaOxClyHz 微颗粒,气溶胶会完全蒸发并形成蒸汽环境。
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来源期刊
Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing 工程技术-材料科学:综合
CiteScore
8.00
自引率
4.90%
发文量
780
审稿时长
42 days
期刊介绍: Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
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