Synergistic effect of sintering temperature on microstructure, mechanical properties, and fractography analysis of spark plasma sintered Al-10 %SiC-4 %Kaoline composite

IF 2.7 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY Materials Letters Pub Date : 2024-10-28 DOI:10.1016/j.matlet.2024.137625

V.S.S. Venkatesh, Pandu Ranga Vundavilli, M.M. Mahapatra

引用次数: 0

Abstract

In this study, aluminium composites reinforced with 10 wt% SiC and 4 wt% kaoline were synthesized through the spark plasma sintering (SPS) technique at different sintering temperatures of 560 ⁰C, 580 ⁰C and 600 ⁰C. The influence of the sintering temperatures on the microstructure and mechanical properties was investigated. Results demonstrate that the maximum relative density (RD), hardness, compression strength, and tensile strength of 96 %, 72 Hv, 284 MPa, and 263 MPa respectively for the composite sintered at 580 ⁰C. The agglomerations were identified at 560 ⁰C through SEM analysis due to improper sintering of the SiC reinforcements which deteriorated the strength of the composite. The presence of dimples on the tensile fractured surface at 580 ⁰C confirms the ductile fracture. However, the existence of intergranular cleavages and particle debonding at 560 ⁰C and 600 ⁰C promotes the brittle fracture.

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烧结温度对火花等离子烧结 Al-10 %SiC-4 %Kaoline 复合材料微观结构、力学性能和断口分析的协同效应

本研究采用火花等离子烧结（SPS）技术，在 560 ℃、580 ℃ 和 600 ℃ 的不同烧结温度下合成了添加 10 wt% SiC 和 4 wt% 高岭土的铝复合材料。研究了烧结温度对微观结构和机械性能的影响。结果表明，在 580 ⁰C 下烧结的复合材料的最大相对密度 (RD)、硬度、压缩强度和拉伸强度分别为 96 %、72 Hv、284 MPa 和 263 MPa。通过扫描电子显微镜分析发现，在 560 ℃ 时出现团聚是由于碳化硅增强材料烧结不当导致复合材料强度下降。580 ⁰C时拉伸断裂表面出现的凹痕证实了韧性断裂。然而，在 560 ℃ 和 600 ℃ 时，晶间劈裂和颗粒脱落的存在促进了脆性断裂。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Materials Letters 工程技术-材料科学：综合

CiteScore

5.60

自引率

3.30%

发文量

1948

审稿时长

50 days

期刊介绍： Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review. Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials. Contributions include, but are not limited to, a variety of topics such as: • Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors • Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart • Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction • Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots. • Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing. • Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic • Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive