Lei Chen , Yuan Niu , Cuihong Liu , Runhong Fan , Peng Liu , Dongxu Ma , Xiaoqing Zhang , Chengzhi Liu , Huigao Duan
{"title":"Reliable transfer enabled by UV-curable stamp with tunable rigidity","authors":"Lei Chen , Yuan Niu , Cuihong Liu , Runhong Fan , Peng Liu , Dongxu Ma , Xiaoqing Zhang , Chengzhi Liu , Huigao Duan","doi":"10.1016/j.surfin.2024.105348","DOIUrl":null,"url":null,"abstract":"<div><div>Transfer printing enables the fabrication of flexible electronics by transferring devices from donor to receiver substrates. However, using an elastic stamp can cause strain and damage during transfer. A rigid stamp can solve this issue, but rigid materials are unsuitable for flexible electronics. In this study, we present a transfer approach using a UV-curable polyurethane acrylate film as a stamp with solvent-induced mechanical properties, from rigidity to elasticity. During the transfer, the UV-curable film is tuned to be rigid to prevent damage to the transferred materials caused by strain during peeling. The approach enables the intact transfer of metallic structures, including various multi-scale Ag patterns with the highest resolution of 10 μm, high transfer yield, and scalability. The interfacial mechanisms of metal transfer were analyzed. The results demonstrate that surface modification through increasing contact angles, improve the stability of metal transfer. When soaked in ethanol, the film becomes soft and elastic, making it an ideal flexible substrate for fabricating electronics, especially for applications in sensing, healthcare, and artificial skin.</div></div>","PeriodicalId":5,"journal":{"name":"ACS Applied Materials & Interfaces","volume":null,"pages":null},"PeriodicalIF":8.3000,"publicationDate":"2024-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Materials & Interfaces","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2468023024015049","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
Transfer printing enables the fabrication of flexible electronics by transferring devices from donor to receiver substrates. However, using an elastic stamp can cause strain and damage during transfer. A rigid stamp can solve this issue, but rigid materials are unsuitable for flexible electronics. In this study, we present a transfer approach using a UV-curable polyurethane acrylate film as a stamp with solvent-induced mechanical properties, from rigidity to elasticity. During the transfer, the UV-curable film is tuned to be rigid to prevent damage to the transferred materials caused by strain during peeling. The approach enables the intact transfer of metallic structures, including various multi-scale Ag patterns with the highest resolution of 10 μm, high transfer yield, and scalability. The interfacial mechanisms of metal transfer were analyzed. The results demonstrate that surface modification through increasing contact angles, improve the stability of metal transfer. When soaked in ethanol, the film becomes soft and elastic, making it an ideal flexible substrate for fabricating electronics, especially for applications in sensing, healthcare, and artificial skin.
期刊介绍:
ACS Applied Materials & Interfaces is a leading interdisciplinary journal that brings together chemists, engineers, physicists, and biologists to explore the development and utilization of newly-discovered materials and interfacial processes for specific applications. Our journal has experienced remarkable growth since its establishment in 2009, both in terms of the number of articles published and the impact of the research showcased. We are proud to foster a truly global community, with the majority of published articles originating from outside the United States, reflecting the rapid growth of applied research worldwide.