Zhenqian Ma, Jinyue Wang, Zhenliang Hao, Jingjie Dai, Xiangyu Zhu, He Zheng, Xiongjun Liu, Hailong Zhang, Zhaoping Lu
{"title":"Novel Graphene-Epoxy Composite with Aligned Architecture and Ultrahigh Thermal Conductivity","authors":"Zhenqian Ma, Jinyue Wang, Zhenliang Hao, Jingjie Dai, Xiangyu Zhu, He Zheng, Xiongjun Liu, Hailong Zhang, Zhaoping Lu","doi":"10.1002/adfm.202412534","DOIUrl":null,"url":null,"abstract":"Because of the surge in the power density of electronic devices, there is an urgent need for improvements in the thermal conductivity of packaging materials. Nowadays, epoxy composites supplemented with thermally conductive fillers are widely used for this purpose, but unfortunately, none of them can satisfactorily meet industrial requirements. Herein, this article reports on a novel method to prepare well-shaped and highly ordered graphene-epoxy composite architecture; that is, the epoxy infiltrates into tubular graphene columns that have been restored to the high thermally conductive structure of graphene. As a result, the newly developed graphene-epoxy composite exhibits record-high thermal conductivity of 69.74 W m<sup>−1</sup> K<sup>−1</sup> with filler content of only 11.22 wt.%. The unprecedentedly high thermal conductivity stems from the construction of thermally conductive channels and restoration of the inherent π–π conjugate structure of graphene. These findings not only offer a breakthrough in packaging materials with significantly enhanced thermal conductivity but also provide a promising avenue for the development of other advanced graphene-added composites.","PeriodicalId":112,"journal":{"name":"Advanced Functional Materials","volume":null,"pages":null},"PeriodicalIF":18.5000,"publicationDate":"2024-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advanced Functional Materials","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1002/adfm.202412534","RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"CHEMISTRY, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
Because of the surge in the power density of electronic devices, there is an urgent need for improvements in the thermal conductivity of packaging materials. Nowadays, epoxy composites supplemented with thermally conductive fillers are widely used for this purpose, but unfortunately, none of them can satisfactorily meet industrial requirements. Herein, this article reports on a novel method to prepare well-shaped and highly ordered graphene-epoxy composite architecture; that is, the epoxy infiltrates into tubular graphene columns that have been restored to the high thermally conductive structure of graphene. As a result, the newly developed graphene-epoxy composite exhibits record-high thermal conductivity of 69.74 W m−1 K−1 with filler content of only 11.22 wt.%. The unprecedentedly high thermal conductivity stems from the construction of thermally conductive channels and restoration of the inherent π–π conjugate structure of graphene. These findings not only offer a breakthrough in packaging materials with significantly enhanced thermal conductivity but also provide a promising avenue for the development of other advanced graphene-added composites.
期刊介绍:
Firmly established as a top-tier materials science journal, Advanced Functional Materials reports breakthrough research in all aspects of materials science, including nanotechnology, chemistry, physics, and biology every week.
Advanced Functional Materials is known for its rapid and fair peer review, quality content, and high impact, making it the first choice of the international materials science community.