Hongxun Fu , Jinyan Zhang , Xu Luo , Yugan Yin , Bowen Yang , Shanqian Ni , Zhenxi Jiang
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引用次数: 0
Abstract
The previous research shows that by installing strain sensors in the strain-sensitive areas of the wheel hub, the strain characteristics of the wheel hub can be measured under different operating conditions. Based on the changing patterns of strain characteristics, a basic method for estimating tire forces can be established. However, when the operating conditions change, the accuracy of the tire force estimation obtained from the basic method is low. This study analyses the strain characteristics of the wheel hub under the variations of factors such as tire pressure, vehicle speed and radial load, and finds that tire pressure is an important correction factor for estimating radial forces, while radial load is an important correction factor for estimating longitudinal and lateral forces. An intelligent correction method for estimating tire forces based on wheel hub strain is proposed according to the changing patterns between key correction factors and wheel hub strain characteristics, and it is validated by simulation experiments. The estimation correction method proposed in this paper comprehensively considers the effects of multiple factors on wheel hub strain based on previous research. Therefore, the constructed tire force estimation model can be applied to a wide range of driving conditions with high estimation accuracy. In addition, this paper conducts research on wheel hub strain instead of tire strain, which takes a new approach to tire force estimation and provides valuable references and insights for the development of intelligent tires in the future.
期刊介绍：
Sensors and Actuators A: Physical brings together multidisciplinary interests in one journal entirely devoted to disseminating information on all aspects of research and development of solid-state devices for transducing physical signals. Sensors and Actuators A: Physical regularly publishes original papers, letters to the Editors and from time to time invited review articles within the following device areas:
• Fundamentals and Physics, such as: classification of effects, physical effects, measurement theory, modelling of sensors, measurement standards, measurement errors, units and constants, time and frequency measurement. Modeling papers should bring new modeling techniques to the field and be supported by experimental results.
• Materials and their Processing, such as: piezoelectric materials, polymers, metal oxides, III-V and II-VI semiconductors, thick and thin films, optical glass fibres, amorphous, polycrystalline and monocrystalline silicon.
• Optoelectronic sensors, such as: photovoltaic diodes, photoconductors, photodiodes, phototransistors, positron-sensitive photodetectors, optoisolators, photodiode arrays, charge-coupled devices, light-emitting diodes, injection lasers and liquid-crystal displays.
• Mechanical sensors, such as: metallic, thin-film and semiconductor strain gauges, diffused silicon pressure sensors, silicon accelerometers, solid-state displacement transducers, piezo junction devices, piezoelectric field-effect transducers (PiFETs), tunnel-diode strain sensors, surface acoustic wave devices, silicon micromechanical switches, solid-state flow meters and electronic flow controllers.
Etc...
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