Preface to a Special Issue E-MRS 2023 Fall Meeting, Symposium A, Integration of advanced materials on silicon, from classical to neuromorphic and quantum applications

IF 2 4区 材料科学 Q3 MATERIALS SCIENCE, COATINGS & FILMS Thin Solid Films Pub Date : 2024-10-30 DOI:10.1016/j.tsf.2024.140539
Abderraouf Boucherif , Andriy Hikavyy , Jacopo Frigerio , Katarzyna Hnida-Gut
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特刊序言 E-MRS 2023 秋季会议,专题讨论会 A,硅上先进材料的集成,从经典到神经形态和量子应用
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Thin Solid Films
Thin Solid Films 工程技术-材料科学:膜
CiteScore
4.00
自引率
4.80%
发文量
381
审稿时长
7.5 months
期刊介绍: Thin Solid Films is an international journal which serves scientists and engineers working in the fields of thin-film synthesis, characterization, and applications. The field of thin films, which can be defined as the confluence of materials science, surface science, and applied physics, has become an identifiable unified discipline of scientific endeavor.
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