Hetero-Integrated InP RTD-SiGe BiCMOS Source With Fundamental Injection Locking

0 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE microwave and wireless technology letters Pub Date : 2024-09-30 DOI:10.1109/LMWT.2024.3458196
E. Mutlu;C. Preuss;F. Vogelsang;R. Kress;J. Bott;B. Sievert;J. Watermann;J. Abts;A. Rennings;D. Erni;N. Pohl;N. Weimann
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Abstract

This work shows the hetero-integration of an InP resonant tunneling diode (RTD) on a SiGe-BiCMOS mm-Wave integrated circuit (MMIC) for near-field wireless fundamental injection locking. We observe injection locking within a locking range of 26 GHz and a total power during injection locking of −3.4 dBm. The SiGe-based local oscillator (LO) is integrated with a frequency doubler and an on-chip patch antenna that operates between 220 and 247 GHz, providing a maximum output power of −7 dBm. The LO is near-field coupled to an InP RTD oscillator integrated into a slot antenna which reaches a free running maximum output power of −6.2 dBm. The chip-to-chip integration is carried out through flip-chip bonding.
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具有基底注入锁定功能的异质集成 InP RTD-SiGe BiCMOS 源
这项工作展示了在 SiGe-BiCMOS 毫米波集成电路 (MMIC) 上异质集成 InP 谐振隧穿二极管 (RTD),用于近场无线基本注入锁定。我们在 26 GHz 的锁定范围内观察到了注入锁定,注入锁定期间的总功率为 -3.4 dBm。基于硅锗(SiGe)的本地振荡器(LO)集成了倍频器和片上贴片天线,工作频率为 220 至 247 GHz,最大输出功率为 -7 dBm。LO 近场耦合到集成在插槽天线中的 InP RTD 振荡器,该振荡器的自由运行最大输出功率为 -6.2 dBm。芯片与芯片之间的集成是通过倒装芯片键合实现的。
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