Effect of CuSO4 content and pH on the mechanical properties and antibacterial ability of copper-plated cement-based material

IF 10.8 1区工程技术 Q1 CONSTRUCTION & BUILDING TECHNOLOGY Cement & concrete composites Pub Date : 2024-11-13 DOI:10.1016/j.cemconcomp.2024.105848

Hongqiang Chu , Weiling Chen , Yi Fang , Yunchao Liang , Baolin Long , Fengchen Zhang , Wenwei Li , Linhua Jiang

{"title":"Effect of CuSO4 content and pH on the mechanical properties and antibacterial ability of copper-plated cement-based material","authors":"Hongqiang Chu , Weiling Chen , Yi Fang , Yunchao Liang , Baolin Long , Fengchen Zhang , Wenwei Li , Linhua Jiang","doi":"10.1016/j.cemconcomp.2024.105848","DOIUrl":null,"url":null,"abstract":"<div><div>Microbial induced concrete corrosion (MICC) is the main deterioration mode of concrete corrosion in concrete wastewater transportation system. Protective coating is one of the commonly used microbial corrosion protection technologies for concrete. In this study, the effects of CuSO<sub>4</sub> concentration and pH value of electroless plating solution on the preparation of copper-plated hardened cement paste (HCP) were investigated, and the antibacterial properties of HCP surface were optimized by electroless copper plating. The main components of the coating were copper and its oxide particles. When HCP was plated at the CuSO<sub>4</sub> concentration of 10 g/L, the copper coating with high mass gain (0.3 %) and Vickers hardness (212.0 HV) was obtained. In addition, cubic copper structure constituted a compact copper coating HCP. The plating solution with pH of 9 was helpful to obtain the best quality gain and Vickers hardness of the coating. The microscopic morphology analysis showed that the coating had a relatively dense structure. Besides, antibacterial test indicated that copper-plated HCP had a significant improvement in antibacterial performance.</div></div>","PeriodicalId":9865,"journal":{"name":"Cement & concrete composites","volume":"155 ","pages":"Article 105848"},"PeriodicalIF":10.8000,"publicationDate":"2024-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Cement & concrete composites","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0958946524004219","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"CONSTRUCTION & BUILDING TECHNOLOGY","Score":null,"Total":0}

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Abstract

Microbial induced concrete corrosion (MICC) is the main deterioration mode of concrete corrosion in concrete wastewater transportation system. Protective coating is one of the commonly used microbial corrosion protection technologies for concrete. In this study, the effects of CuSO₄ concentration and pH value of electroless plating solution on the preparation of copper-plated hardened cement paste (HCP) were investigated, and the antibacterial properties of HCP surface were optimized by electroless copper plating. The main components of the coating were copper and its oxide particles. When HCP was plated at the CuSO₄ concentration of 10 g/L, the copper coating with high mass gain (0.3 %) and Vickers hardness (212.0 HV) was obtained. In addition, cubic copper structure constituted a compact copper coating HCP. The plating solution with pH of 9 was helpful to obtain the best quality gain and Vickers hardness of the coating. The microscopic morphology analysis showed that the coating had a relatively dense structure. Besides, antibacterial test indicated that copper-plated HCP had a significant improvement in antibacterial performance.

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CuSO4 含量和 pH 值对镀铜水泥基材料力学性能和抗菌能力的影响

微生物诱发的混凝土腐蚀（MICC）是混凝土污水输送系统中混凝土腐蚀的主要恶化模式。保护涂层是常用的混凝土微生物腐蚀防护技术之一。本研究考察了 CuSO4 浓度和无电解镀液 pH 值对制备镀铜硬化水泥浆（HCP）的影响，并通过无电解镀铜优化了 HCP 表面的抗菌性能。镀层的主要成分是铜及其氧化物颗粒。当 HCP 的 CuSO4 浓度为 10 g/L 时，镀铜层的质量增益（0.3%）和维氏硬度（212.0 HV）都很高。此外，立方体铜结构构成了紧密的铜镀层 HCP。pH 值为 9 的电镀液有助于获得最佳的镀层质量增益和维氏硬度。显微形态分析表明，镀层具有相对致密的结构。此外，抗菌测试表明，镀铜 HCP 的抗菌性能显著提高。

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来源期刊

Cement & concrete composites 工程技术-材料科学：复合

CiteScore

18.70

自引率

11.40%

发文量

459

审稿时长

65 days

期刊介绍： Cement & concrete composites focuses on advancements in cement-concrete composite technology and the production, use, and performance of cement-based construction materials. It covers a wide range of materials, including fiber-reinforced composites, polymer composites, ferrocement, and those incorporating special aggregates or waste materials. Major themes include microstructure, material properties, testing, durability, mechanics, modeling, design, fabrication, and practical applications. The journal welcomes papers on structural behavior, field studies, repair and maintenance, serviceability, and sustainability. It aims to enhance understanding, provide a platform for unconventional materials, promote low-cost energy-saving materials, and bridge the gap between materials science, engineering, and construction. Special issues on emerging topics are also published to encourage collaboration between materials scientists, engineers, designers, and fabricators.