Potential Multiparameter Sensor Based on Thin-Cladding Fiber Helical Long-Period Fiber Gratings

IF 4.3 2区 综合性期刊 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Sensors Journal Pub Date : 2024-10-10 DOI:10.1109/JSEN.2024.3474257
Yunhe Zhao;Mengying Hu;Ziyang Hua;Yan Jiang;Xin Wang;Mengjiao Ding;Yunqi Liu;Zuyuan He
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Abstract

In this article, we propose and demonstrate a potential multiparameter sensor based on helical long-period fiber gratings (HLPFGs) in thin-cladding fiber (TCF) using CO2 laser inscription. The fabricated TCF-HLPFGs with a grating period of $132~\mu $ m and a short length of ~2 cm exhibit two distinct resonance dips (dip1 and dip2) in the transmission spectrum with large wavelength separation of 241.2 nm, corresponding to the coupling from fundamental core mode to the LP16 and LP17 cladding modes, respectively. Then, a comparative investigation of the bending, refractive index (RI), and temperature sensing based on both dual dips is demonstrated. Within the curvature range of 1.47–5.05 m $^{-{1}}$ , the bending sensitivity of −6.75 and 9.32 nm/m $^{-{1}}$ could be achieved for dip1 and dip2, respectively. In surrounding RI (SRI) region of 1.3839–1.443, the sensitivities of dip1 and dip2 are measured to be −150.8 and −647.75 nm/RIU on wavelength and 31.93 and −200.77 dB/RIU on transmission depth, respectively. And the temperature sensitivities are 48 and 78 pm/°C, for dip1 and dip2, respectively. The results present that dip2 outperforms dip1 with higher sensitivities, due to the effect of higher order cladding modes. With the superior performance and good repeatability in the bending reaction of the proposed TCF-HLPFGs, the simultaneous measurement of bending and temperature could be achieved. Therefore, the proposed TCF-HLPFGs offer great potential in the field of multiparameter sensing measurement.
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基于薄包层光纤螺旋长周期光纤光栅的潜在多参数传感器
在这篇文章中,我们提出并演示了一种潜在的多参数传感器,该传感器基于薄包层光纤(TCF)中的螺旋长周期光纤光栅(HLPFGs),采用二氧化碳激光刻蚀技术。制作的TCF-HLPFG的光栅周期为132~\mu $ m,长度较短,约为2 cm,在波长间隔为241.2 nm的透射光谱中显示出两个不同的共振点(dip1和dip2),分别对应于基波纤芯模式与LP16和LP17包层模式的耦合。然后,对基于这两种双凹陷的弯曲、折射率(RI)和温度传感进行了比较研究。在 1.47-5.05 m $^{-{1}}$ 的曲率范围内,dip1 和 dip2 的弯曲灵敏度分别为 -6.75 和 9.32 nm/m $^{-{1}}$。在 1.3839-1.443 的环绕 RI(SRI)区域,测得 dip1 和 dip2 的灵敏度分别为波长 -150.8 和 -647.75 nm/RIU,透射深度 31.93 和 -200.77 dB/RIU。dip1 和 dip2 的温度灵敏度分别为 48 和 78 pm/°C。结果表明,由于高阶包层模式的影响,dip2 的灵敏度高于 dip1。由于所提出的 TCF-HLPFG 在弯曲反应方面具有卓越的性能和良好的可重复性,因此可以实现弯曲和温度的同时测量。因此,所提出的 TCF-HLPFG 在多参数传感测量领域具有巨大潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Sensors Journal
IEEE Sensors Journal 工程技术-工程:电子与电气
CiteScore
7.70
自引率
14.00%
发文量
2058
审稿时长
5.2 months
期刊介绍: The fields of interest of the IEEE Sensors Journal are the theory, design , fabrication, manufacturing and applications of devices for sensing and transducing physical, chemical and biological phenomena, with emphasis on the electronics and physics aspect of sensors and integrated sensors-actuators. IEEE Sensors Journal deals with the following: -Sensor Phenomenology, Modelling, and Evaluation -Sensor Materials, Processing, and Fabrication -Chemical and Gas Sensors -Microfluidics and Biosensors -Optical Sensors -Physical Sensors: Temperature, Mechanical, Magnetic, and others -Acoustic and Ultrasonic Sensors -Sensor Packaging -Sensor Networks -Sensor Applications -Sensor Systems: Signals, Processing, and Interfaces -Actuators and Sensor Power Systems -Sensor Signal Processing for high precision and stability (amplification, filtering, linearization, modulation/demodulation) and under harsh conditions (EMC, radiation, humidity, temperature); energy consumption/harvesting -Sensor Data Processing (soft computing with sensor data, e.g., pattern recognition, machine learning, evolutionary computation; sensor data fusion, processing of wave e.g., electromagnetic and acoustic; and non-wave, e.g., chemical, gravity, particle, thermal, radiative and non-radiative sensor data, detection, estimation and classification based on sensor data) -Sensors in Industrial Practice
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