Xiaodan Li , Rui He , Zecong Wei , Shiyun Meng , Zhenhua Fan
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引用次数: 0
Abstract
Cyanate ester resin (CE), a high-performance and low dielectric materials, was modified with amino hollow silica (HSMs-NH2) and polyimide resin (PI) to form an IPN structure. Reducing the crosslinking density of the composite system and accompanying with its steric hindrance effect, PI increased the free volume of the composite material. The hollow structure introduced by HSMs-NH2 further enhanced a low dielectric property. IPN structure and HSMs-NH2 also significantly improved the impact toughness of HSMs-NH2/PI/CE composites. The bonding between the Si–O–Si and HSMs-NH2 offered an excellent heat resistance and as well surface bonding capability to matrix, which reduced the decomposition and effectively improved their thermal stability. Simultaneously, profited by the hydrophobicity of Si–O–Si, HSMs-NH2/PI/CE composite materials enabled to keep low dielectric properties in humid environments.
期刊介绍：
Polymer is an interdisciplinary journal dedicated to publishing innovative and significant advances in Polymer Physics, Chemistry and Technology. We welcome submissions on polymer hybrids, nanocomposites, characterisation and self-assembly. Polymer also publishes work on the technological application of polymers in energy and optoelectronics.
The main scope is covered but not limited to the following core areas:
Polymer Materials
Nanocomposites and hybrid nanomaterials
Polymer blends, films, fibres, networks and porous materials
Physical Characterization
Characterisation, modelling and simulation* of molecular and materials properties in bulk, solution, and thin films
Polymer Engineering
Advanced multiscale processing methods
Polymer Synthesis, Modification and Self-assembly
Including designer polymer architectures, mechanisms and kinetics, and supramolecular polymerization
Technological Applications
Polymers for energy generation and storage
Polymer membranes for separation technology
Polymers for opto- and microelectronics.
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