Experimental investigation of pool boiling on Ti-Cu composite coated surfaces prepared using Electric Discharge Coating

IF 4.9 2区 工程技术 Q1 ENGINEERING, MECHANICAL International Journal of Thermal Sciences Pub Date : 2024-11-11 DOI:10.1016/j.ijthermalsci.2024.109529
Amatya Bharadwaj, Rahul Dev Misra
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Abstract

Boiling heat transfer has become a very potent two-phase heat transfer mechanism for cooling high heat-producing devices such as microelectronic devices, fusion reactors or turbine blades. Increasing research has shown that micro/nano-structures on surfaces increase the number of nucleation sites for bubble formation, which ultimately results in a major improvement in boiling performance. This led to studies on developing various coated surfaces in order to generate micro/nano-structures on surfaces. In the current study, microstructured boiling surfaces were prepared using the Electric Discharge Coating (EDC) process. Titanium-copper (Ti-Cu) composite microparticles were coated on copper surface under reverse polarity in the Electric Discharge Machine. Four surfaces were prepared by using current settings of 3 A, 4 A, 5 A and 6 A. It was followed by characterisation of the surfaces which included, wettability analysis, porosity, pore size estimation, mean roughness measurement and elemental analysis, in order to better understand the boiling results on the surfaces. The surfaces formed were hydrophilic in nature, with contact angles varying from 47° to 65°. Pool boiling were performed with the developed surfaces and critical heat flux (CHF) and nucleate boiling heat transfer coefficient (NBHTC) improvement of 37.17 % and 172 % respectively were observed with the best performing surface compared to the bare surface. The best performing surface was also compared with relevant published literature to determine its standing against the present state of the art.
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放电涂层制备的钛铜复合涂层表面池沸腾的实验研究
沸腾传热已成为冷却微电子设备、核聚变反应堆或涡轮叶片等高发热设备的一种非常有效的两相传热机制。越来越多的研究表明,表面的微/纳米结构可增加气泡形成的成核点数量,从而最终大大提高沸腾性能。因此,人们开始研究开发各种涂层表面,以便在表面上产生微/纳米结构。在当前的研究中,使用放电涂层 (EDC) 工艺制备了微结构沸腾表面。钛-铜(Ti-Cu)复合微颗粒在放电仪的反极性条件下被涂覆在铜表面。随后对表面进行了表征,包括润湿性分析、孔隙率、孔径估算、平均粗糙度测量和元素分析,以便更好地了解表面的沸腾结果。所形成的表面具有亲水性,接触角从 47° 到 65° 不等。使用开发的表面进行了池沸腾,观察到临界热通量(CHF)和成核沸腾传热系数(NBHTC)与裸表面相比分别提高了 37.17% 和 172%。此外,还将性能最佳的表面与已发表的相关文献进行了比较,以确定其与现有技术水平的差距。
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来源期刊
International Journal of Thermal Sciences
International Journal of Thermal Sciences 工程技术-工程:机械
CiteScore
8.10
自引率
11.10%
发文量
531
审稿时长
55 days
期刊介绍: The International Journal of Thermal Sciences is a journal devoted to the publication of fundamental studies on the physics of transfer processes in general, with an emphasis on thermal aspects and also applied research on various processes, energy systems and the environment. Articles are published in English and French, and are subject to peer review. The fundamental subjects considered within the scope of the journal are: * Heat and relevant mass transfer at all scales (nano, micro and macro) and in all types of material (heterogeneous, composites, biological,...) and fluid flow * Forced, natural or mixed convection in reactive or non-reactive media * Single or multi–phase fluid flow with or without phase change * Near–and far–field radiative heat transfer * Combined modes of heat transfer in complex systems (for example, plasmas, biological, geological,...) * Multiscale modelling The applied research topics include: * Heat exchangers, heat pipes, cooling processes * Transport phenomena taking place in industrial processes (chemical, food and agricultural, metallurgical, space and aeronautical, automobile industries) * Nano–and micro–technology for energy, space, biosystems and devices * Heat transport analysis in advanced systems * Impact of energy–related processes on environment, and emerging energy systems The study of thermophysical properties of materials and fluids, thermal measurement techniques, inverse methods, and the developments of experimental methods are within the scope of the International Journal of Thermal Sciences which also covers the modelling, and numerical methods applied to thermal transfer.
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