{"title":"Additive manufacturing-assisted casting of 3D micro-architected heat sinks","authors":"Oraib Al-Ketan","doi":"10.1016/j.matlet.2024.137641","DOIUrl":null,"url":null,"abstract":"<div><div>The rapid advancement in electronic devices has heightened thermal management challenges. This study presents the fabrication of 3D micro-architected heatsinks using additive manufacturing (AM) assisted casting. This approach merges AM’s design flexibility with casting’s cost-effectiveness and versatility, enabling complex heatsink geometries. The fabricated heatsinks were analyzed using scanning electron microscopy and computed tomography. The thermal behavior of the heatsinks was assessed in forced convection conditions. A temperature drop at the base ranging from 5% to 13% was measured.</div></div>","PeriodicalId":384,"journal":{"name":"Materials Letters","volume":"379 ","pages":"Article 137641"},"PeriodicalIF":2.7000,"publicationDate":"2024-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Letters","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0167577X24017816","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
The rapid advancement in electronic devices has heightened thermal management challenges. This study presents the fabrication of 3D micro-architected heatsinks using additive manufacturing (AM) assisted casting. This approach merges AM’s design flexibility with casting’s cost-effectiveness and versatility, enabling complex heatsink geometries. The fabricated heatsinks were analyzed using scanning electron microscopy and computed tomography. The thermal behavior of the heatsinks was assessed in forced convection conditions. A temperature drop at the base ranging from 5% to 13% was measured.
期刊介绍:
Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review.
Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials.
Contributions include, but are not limited to, a variety of topics such as:
• Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors
• Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart
• Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction
• Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots.
• Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing.
• Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic
• Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive