{"title":"Microstructural evolution of polycrystalline α-Fe/Fe3C ultra-precision grinded under water lubrication","authors":"Changjiang Zhou , Fa Zhang , Haifeng Chen , Ningwei Xia","doi":"10.1016/j.jmapro.2024.11.007","DOIUrl":null,"url":null,"abstract":"<div><div>Ultra-precision grinding has gained substantial attention for its ability to significantly improve surface integrity. However, existing studies rarely investigate the effects of lubrication conditions at the microscopic level, which limits the understanding of microstructure evolution during ultra-precision grinding. In this work, a large-scale molecular dynamic (MD) method is proposed for simulating microstructural evolution of polycrystalline α-Fe/Fe<sub>3</sub>C ultra-precision grinded under water lubrication. The water molecule and polycrystalline α-Fe/Fe<sub>3</sub>C models are established using the measured and calculated interatomic potential functions. The effects of grinding parameters (infeed depth and lubrication status) on the ultra-precision grinding of internal stresses, temperature fields, workpiece topography and plastic deformation are investigated. Results show that the water film has a beneficial impact on workpiece quality, but has a negative effect on grinding efficiency. The plastic deformation mechanism of ultra-precision grinded polycrystalline α-Fe/Fe<sub>3</sub>C primarily involves dislocation modulation, with the water film serving to reduce dislocations and promote cluster formation. This work offers valuable insights into the production of high-quality components.</div></div>","PeriodicalId":16148,"journal":{"name":"Journal of Manufacturing Processes","volume":"132 ","pages":"Pages 467-476"},"PeriodicalIF":6.1000,"publicationDate":"2024-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Manufacturing Processes","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S152661252401137X","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
引用次数: 0
Abstract
Ultra-precision grinding has gained substantial attention for its ability to significantly improve surface integrity. However, existing studies rarely investigate the effects of lubrication conditions at the microscopic level, which limits the understanding of microstructure evolution during ultra-precision grinding. In this work, a large-scale molecular dynamic (MD) method is proposed for simulating microstructural evolution of polycrystalline α-Fe/Fe3C ultra-precision grinded under water lubrication. The water molecule and polycrystalline α-Fe/Fe3C models are established using the measured and calculated interatomic potential functions. The effects of grinding parameters (infeed depth and lubrication status) on the ultra-precision grinding of internal stresses, temperature fields, workpiece topography and plastic deformation are investigated. Results show that the water film has a beneficial impact on workpiece quality, but has a negative effect on grinding efficiency. The plastic deformation mechanism of ultra-precision grinded polycrystalline α-Fe/Fe3C primarily involves dislocation modulation, with the water film serving to reduce dislocations and promote cluster formation. This work offers valuable insights into the production of high-quality components.
期刊介绍:
The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.