An innovative interlayer improving the interfacial connection of FeCoNiCrTi coating on copper surface

Abstract

To improve the performance of copper surface, a FeCoNiCrTi high entropy alloy coating was first attempted to be prepared on copper substrate by plasma cladding. The obtained single-layer coating had a smooth and flat surface, but the interfacial connection was poor. Interfacial defect analysis results showed that the alloying elements dominated by Ti in the coating reacted with the CuO formed during the preheating process on copper surface. A large amount of TiO₂ and other complex oxides were generated and distributed at the interface, which hindered the interfacial connection. After introducing a Ni60A interlayer, the interface reaction between FeCoNiCrTi alloy and copper oxide was avoided, and the inter-diffusion of elements was promoted, thus forming a good metallurgical bonding. Furthermore, due to the dilution effect of Ni60A interlayer, the performance of FeCoNiCrTi surface layer slightly decreased, but still far superior to the Ni60A coating. The microhardness of FeCoNiCrTi surface layer was about 10.7 times that of copper substrate. The wear loss of the developed coating is only 1/2 of that of the single Ni60A coating at 600 °C. This study has a great significance for extending the application of FeCoNiCrTi high entropy alloy coatings in surface strengthening on copper.