Improving thermal conductivity of phthalonitrile composite through constructing three-dimensional graphene networks and interfacial engineering

IF 6.5 2区 材料科学 Q1 MATERIALS SCIENCE, COMPOSITES Composites Communications Pub Date : 2024-11-05 DOI:10.1016/j.coco.2024.102134
Yanmin Pei , Jiangnan Ding , Chao Zhou , Kun Zheng , Heng Zhou , Tong Zhao
{"title":"Improving thermal conductivity of phthalonitrile composite through constructing three-dimensional graphene networks and interfacial engineering","authors":"Yanmin Pei ,&nbsp;Jiangnan Ding ,&nbsp;Chao Zhou ,&nbsp;Kun Zheng ,&nbsp;Heng Zhou ,&nbsp;Tong Zhao","doi":"10.1016/j.coco.2024.102134","DOIUrl":null,"url":null,"abstract":"<div><div>Achieving high thermal conductivity for polymer composite with low filler loading is still a challenge. Here, phthalonitrile (APN)/few-layer graphene (FLG) composite with high thermal conductivity was successfully prepared by constructing three dimensional (3D) thermally conductive pathways. Such 3D structure was formed by hot compressing APN@FLG core-shell structures. The results showed that the thermal conductivity of APN@FLG composites with only 30 wt% of FLG was up to 11.4Wm<sup>−1</sup>K<sup>−1</sup>, which was 57 times to that of the pristine resin (0.2 Wm<sup>−1</sup>K<sup>−1</sup>). Such high thermal conductivity was attributed to the 3D connected thermally conductive networks. Furthermore, benefited from the high thermal stability of APN matrix, the as-prepared composite also showed high T<sub>5</sub> (temperature of mass losing 5 %) of higher than 500 °C. The composite with both high thermal conductivity and heat resistance are expected to be an idea candidate for high temperature thermal management applications.</div></div>","PeriodicalId":10533,"journal":{"name":"Composites Communications","volume":"52 ","pages":"Article 102134"},"PeriodicalIF":6.5000,"publicationDate":"2024-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Composites Communications","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2452213924003255","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, COMPOSITES","Score":null,"Total":0}
引用次数: 0

Abstract

Achieving high thermal conductivity for polymer composite with low filler loading is still a challenge. Here, phthalonitrile (APN)/few-layer graphene (FLG) composite with high thermal conductivity was successfully prepared by constructing three dimensional (3D) thermally conductive pathways. Such 3D structure was formed by hot compressing APN@FLG core-shell structures. The results showed that the thermal conductivity of APN@FLG composites with only 30 wt% of FLG was up to 11.4Wm−1K−1, which was 57 times to that of the pristine resin (0.2 Wm−1K−1). Such high thermal conductivity was attributed to the 3D connected thermally conductive networks. Furthermore, benefited from the high thermal stability of APN matrix, the as-prepared composite also showed high T5 (temperature of mass losing 5 %) of higher than 500 °C. The composite with both high thermal conductivity and heat resistance are expected to be an idea candidate for high temperature thermal management applications.

Abstract Image

查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
通过构建三维石墨烯网络和界面工程改善邻苯二腈复合材料的导热性能
如何在低填料含量的聚合物复合材料中实现高导热性仍然是一项挑战。在这里,通过构建三维(3D)导热通道,成功制备了具有高导热性的邻苯二腈(APN)/几层石墨烯(FLG)复合材料。这种三维结构是通过热压 APN@FLG 核壳结构形成的。结果表明,仅含有 30 wt% FLG 的 APN@FLG 复合材料的导热系数高达 11.4Wm-1K-1,是原始树脂(0.2 Wm-1K-1)的 57 倍。如此高的热导率归功于三维连接的导热网络。此外,得益于 APN 基体的高热稳定性,制备的复合材料还显示出高于 500 °C 的高 T5(质量损失 5 % 的温度)。这种同时具有高热导率和高耐热性的复合材料有望成为高温热管理应用的理想候选材料。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
Composites Communications
Composites Communications Materials Science-Ceramics and Composites
CiteScore
12.10
自引率
10.00%
发文量
340
审稿时长
36 days
期刊介绍: Composites Communications (Compos. Commun.) is a peer-reviewed journal publishing short communications and letters on the latest advances in composites science and technology. With a rapid review and publication process, its goal is to disseminate new knowledge promptly within the composites community. The journal welcomes manuscripts presenting creative concepts and new findings in design, state-of-the-art approaches in processing, synthesis, characterization, and mechanics modeling. In addition to traditional fiber-/particulate-reinforced engineering composites, it encourages submissions on composites with exceptional physical, mechanical, and fracture properties, as well as those with unique functions and significant application potential. This includes biomimetic and bio-inspired composites for biomedical applications, functional nano-composites for thermal management and energy applications, and composites designed for extreme service environments.
期刊最新文献
Editorial Board Research on the anti-frost performance of hydrophobic TiN-polymer composite coating on aluminum alloy surface Enhanced stress relaxation resistance and strength-electrical conductivity combination of graphene reinforced Cu-0.5La composite wire for high temperature applications Construction of Al3+-carboxymethyl cellulose superhydrophilic layer on wood filter surface for highly efficient oil/water emulsion separation Multiscale study on the synergistic effect of interface heat transfer and filler structure on enhancing the thermal conductivity of boron nitride/alumina/polyurethane composites
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1