Effective High-Speed via Model Considering Equivalent High-Order-Mode Inductance

Chaofeng Li;Xiao-Ding Cai;Manish K. Mathew;Junyong Park;Mehdi Mousavi;Shameem Ahmed;Bidyut Sen;DongHyun Kim
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Abstract

A high-speed via model considering equivalent high-order-mode inductance for frequencies above 70 GHz is proposed in this article. The proposed via model, which considers the equivalent high-order-mode inductance, is a high-accuracy and high-bandwidth via model, improved from the previously proposed mode-decomposition-based equivalent via (MEV) model. The equivalent high-order-mode inductance is an inductance produced by the magnetic fields of high-order modes in the via domain. By including the empirical equivalent high-order-mode inductance, the proposed via model accurately predicts the insertion and return losses of the via with a large antipad size up to the frequency of 150 GHz, which expands the application range of the previously proposed MEV model. In this article, the limitation of the previously proposed MEV model is analyzed by comparing the input impedance extracted from the MEV model and the full-wave simulation. An empirical closed-form formula is proposed to calculate the equivalent high-order-mode inductance at high frequencies to improve the accuracy of the previously proposed model. In addition, the proposed single high-speed via model was expanded to a differential via pair model. The proposed high-speed via model was verified using simulation and measurement results.
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考虑等效高阶模式电感的有效高速通路模型
本文提出了一种考虑到等效高阶模式电感的高速通孔模型,适用于 70 GHz 以上的频率。所提出的通孔模型考虑了等效高阶模式电感,是一种高精度、高带宽的通孔模型,与之前提出的基于模式分解的等效通孔(MEV)模型相比有所改进。等效高阶模式电感是通孔域中高阶模式磁场产生的电感。通过加入经验等效高阶模电感,所提出的通孔模型能准确预测反垫尺寸较大、频率高达 150 GHz 的通孔的插入损耗和回波损耗,从而扩大了之前提出的 MEV 模型的应用范围。本文通过比较从 MEV 模型和全波仿真中提取的输入阻抗,分析了之前提出的 MEV 模型的局限性。本文提出了一个经验闭式公式来计算高频率下的等效高阶模式电感,以提高之前提出的模型的准确性。此外,还将提出的单高速通孔模型扩展为差分通孔对模型。仿真和测量结果验证了所提出的高速通孔模型。
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