{"title":"Optimized Photonic-Electronic Co-Design for Hybrid Integrated Silicon-Based Optical Transmitters","authors":"Daofa Wang;Ye Jin;Han Liu;Yingjie Ma;Ang Li;Yujun Xie;Menghan Yang;Guike Li;Yang Qu;Peng Wang;Ye Xiao;Jinping Guo;Rui Yang;Wei Li;Nan Qi;Ming Li","doi":"10.1109/LPT.2024.3496088","DOIUrl":null,"url":null,"abstract":"The increasing demand for high-speed and energy-efficient data transmission in global communication networks has driven the development of advanced optical interconnect technologies. This work explores the integration of an optical transmitter utilizing silicon photonic Mach-Zehnder modulators (MZMs) and drivers through a wire-bonding package. Fabricated on a silicon-on-insulator (SOI) platform, the MZMs leverage a single-drive series push-pull design to achieve high-speed modulation up to 112 Gbps and a 37 GHz bandwidth at a 3 V reverse DC bias, along with a modulation efficiency of 2.16 V\n<inline-formula> <tex-math>$\\cdot $ </tex-math></inline-formula>\n cm. The transmitter architecture incorporates a four-channel driver array, and experimental results demonstrate a bandwidth of 46 GHz with the capability to deliver a total data rate beyond 200 Gbps. An optimized photonic-electronic co-design on optoelectronic chips holds the promise of facilitating higher data transmission rates.","PeriodicalId":13065,"journal":{"name":"IEEE Photonics Technology Letters","volume":"36 24","pages":"1473-1476"},"PeriodicalIF":2.3000,"publicationDate":"2024-11-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Photonics Technology Letters","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10750228/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
The increasing demand for high-speed and energy-efficient data transmission in global communication networks has driven the development of advanced optical interconnect technologies. This work explores the integration of an optical transmitter utilizing silicon photonic Mach-Zehnder modulators (MZMs) and drivers through a wire-bonding package. Fabricated on a silicon-on-insulator (SOI) platform, the MZMs leverage a single-drive series push-pull design to achieve high-speed modulation up to 112 Gbps and a 37 GHz bandwidth at a 3 V reverse DC bias, along with a modulation efficiency of 2.16 V
$\cdot $
cm. The transmitter architecture incorporates a four-channel driver array, and experimental results demonstrate a bandwidth of 46 GHz with the capability to deliver a total data rate beyond 200 Gbps. An optimized photonic-electronic co-design on optoelectronic chips holds the promise of facilitating higher data transmission rates.
期刊介绍:
IEEE Photonics Technology Letters addresses all aspects of the IEEE Photonics Society Constitutional Field of Interest with emphasis on photonic/lightwave components and applications, laser physics and systems and laser/electro-optics technology. Examples of subject areas for the above areas of concentration are integrated optic and optoelectronic devices, high-power laser arrays (e.g. diode, CO2), free electron lasers, solid, state lasers, laser materials'' interactions and femtosecond laser techniques. The letters journal publishes engineering, applied physics and physics oriented papers. Emphasis is on rapid publication of timely manuscripts. A goal is to provide a focal point of quality engineering-oriented papers in the electro-optics field not found in other rapid-publication journals.