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IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-12-19 DOI: 10.1109/LPT.2025.3641071
{"title":"Blank Page","authors":"","doi":"10.1109/LPT.2025.3641071","DOIUrl":"https://doi.org/10.1109/LPT.2025.3641071","url":null,"abstract":"","PeriodicalId":13065,"journal":{"name":"IEEE Photonics Technology Letters","volume":"37 23","pages":"C4-C4"},"PeriodicalIF":2.5,"publicationDate":"2025-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11306153","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145778435","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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IEEE Photonics Technology Letters publication information IEEE Photonics Technology Letters出版信息
IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-12-19 DOI: 10.1109/LPT.2025.3640998
{"title":"IEEE Photonics Technology Letters publication information","authors":"","doi":"10.1109/LPT.2025.3640998","DOIUrl":"https://doi.org/10.1109/LPT.2025.3640998","url":null,"abstract":"","PeriodicalId":13065,"journal":{"name":"IEEE Photonics Technology Letters","volume":"37 22","pages":"C2-C2"},"PeriodicalIF":2.5,"publicationDate":"2025-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11306186","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145778445","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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IEEE Photonics Technology Letters Information for Authors IEEE Photonics Technology Letters for Authors
IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-12-19 DOI: 10.1109/LPT.2025.3641069
{"title":"IEEE Photonics Technology Letters Information for Authors","authors":"","doi":"10.1109/LPT.2025.3641069","DOIUrl":"https://doi.org/10.1109/LPT.2025.3641069","url":null,"abstract":"","PeriodicalId":13065,"journal":{"name":"IEEE Photonics Technology Letters","volume":"37 23","pages":"C3-C3"},"PeriodicalIF":2.5,"publicationDate":"2025-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11305698","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145778437","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Photonics Technology Letters Information for Authors IEEE Photonics Technology Letters for Authors
IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-12-19 DOI: 10.1109/LPT.2025.3641002
{"title":"IEEE Photonics Technology Letters Information for Authors","authors":"","doi":"10.1109/LPT.2025.3641002","DOIUrl":"https://doi.org/10.1109/LPT.2025.3641002","url":null,"abstract":"","PeriodicalId":13065,"journal":{"name":"IEEE Photonics Technology Letters","volume":"37 22","pages":"C3-C3"},"PeriodicalIF":2.5,"publicationDate":"2025-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11306188","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145778418","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Photonics Technology Letters publication information IEEE Photonics Technology Letters出版信息
IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-12-19 DOI: 10.1109/LPT.2025.3641065
{"title":"IEEE Photonics Technology Letters publication information","authors":"","doi":"10.1109/LPT.2025.3641065","DOIUrl":"https://doi.org/10.1109/LPT.2025.3641065","url":null,"abstract":"","PeriodicalId":13065,"journal":{"name":"IEEE Photonics Technology Letters","volume":"37 23","pages":"C2-C2"},"PeriodicalIF":2.5,"publicationDate":"2025-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11306148","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145778436","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-12-19 DOI: 10.1109/LPT.2025.3640923
{"title":"Blank Page","authors":"","doi":"10.1109/LPT.2025.3640923","DOIUrl":"https://doi.org/10.1109/LPT.2025.3640923","url":null,"abstract":"","PeriodicalId":13065,"journal":{"name":"IEEE Photonics Technology Letters","volume":"37 21","pages":"C4-C4"},"PeriodicalIF":2.5,"publicationDate":"2025-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11306132","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145778416","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-12-19 DOI: 10.1109/LPT.2025.3641004
{"title":"Blank Page","authors":"","doi":"10.1109/LPT.2025.3641004","DOIUrl":"https://doi.org/10.1109/LPT.2025.3641004","url":null,"abstract":"","PeriodicalId":13065,"journal":{"name":"IEEE Photonics Technology Letters","volume":"37 22","pages":"C4-C4"},"PeriodicalIF":2.5,"publicationDate":"2025-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11306215","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145778444","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Photonics Technology Letters Information for Authors IEEE Photonics Technology Letters for Authors
IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-12-19 DOI: 10.1109/LPT.2025.3640921
{"title":"IEEE Photonics Technology Letters Information for Authors","authors":"","doi":"10.1109/LPT.2025.3640921","DOIUrl":"https://doi.org/10.1109/LPT.2025.3640921","url":null,"abstract":"","PeriodicalId":13065,"journal":{"name":"IEEE Photonics Technology Letters","volume":"37 21","pages":"C3-C3"},"PeriodicalIF":2.5,"publicationDate":"2025-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11306127","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145778414","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
High Temperature Stable 850-nm VCSELs With Improved Device Thermal Conductivity 具有改进器件导热性的850纳米高温稳定VCSELs
IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-11-26 DOI: 10.1109/LPT.2025.3637572
Yun Sun;Wenjing Jiang;Meng Xun;Guanzhong Pan;Bingxin Yao;Runze Zhang;Weichao Wu;Dexin Wu
In this work, we present the highly temperature-stable 850-nm oxide-aperture vertical cavity surface-emitting lasers with via-hole device structure. The temperature dependence of static and dynamic characteristics of devices are investigated. The output power of 7.13 mW saturating at high thermal rollover current of 12.5 mA at $29~^{circ }$ C and only 2.7 GHz 3-dB optical bandwidth drop over the temperature range from 29 to $85~^{circ }$ C is observed for the VCSEL with a $sim ~4.6~mu $ m oxide-aperture diameter. The thermal resistance of the VCSELs and the internal device temperature are analysed by using the measured optical spectra. The results clearly indicate that the high temperature stability of our devices can be attributed to both improved thermal conductivity benefited from via-hole device structure and optimized quantum well gain-to-etalon wavelength offset.
在这项工作中,我们提出了具有过孔器件结构的850 nm高温度稳定的氧化孔径垂直腔面发射激光器。研究了器件静态和动态特性对温度的依赖关系。对于孔径为$sim ~4.6~mu $ m的VCSEL,在温度为$29~^{circ }$℃时,在12.5 mA的高温下饱和输出功率为7.13 mW,在29 ~ $85~^{circ }$℃的温度范围内,光带宽仅下降2.7 GHz。利用实测光谱分析了vcsel的热阻和器件内部温度。结果清楚地表明,我们的器件的高温稳定性可以归因于通过孔器件结构改善的热导率和优化的量子阱增益-标准子波长偏移。
{"title":"High Temperature Stable 850-nm VCSELs With Improved Device Thermal Conductivity","authors":"Yun Sun;Wenjing Jiang;Meng Xun;Guanzhong Pan;Bingxin Yao;Runze Zhang;Weichao Wu;Dexin Wu","doi":"10.1109/LPT.2025.3637572","DOIUrl":"https://doi.org/10.1109/LPT.2025.3637572","url":null,"abstract":"In this work, we present the highly temperature-stable 850-nm oxide-aperture vertical cavity surface-emitting lasers with via-hole device structure. The temperature dependence of static and dynamic characteristics of devices are investigated. The output power of 7.13 mW saturating at high thermal rollover current of 12.5 mA at <inline-formula> <tex-math>$29~^{circ }$ </tex-math></inline-formula>C and only 2.7 GHz 3-dB optical bandwidth drop over the temperature range from 29 to <inline-formula> <tex-math>$85~^{circ }$ </tex-math></inline-formula>C is observed for the VCSEL with a <inline-formula> <tex-math>$sim ~4.6~mu $ </tex-math></inline-formula> m oxide-aperture diameter. The thermal resistance of the VCSELs and the internal device temperature are analysed by using the measured optical spectra. The results clearly indicate that the high temperature stability of our devices can be attributed to both improved thermal conductivity benefited from via-hole device structure and optimized quantum well gain-to-etalon wavelength offset.","PeriodicalId":13065,"journal":{"name":"IEEE Photonics Technology Letters","volume":"38 5","pages":"309-312"},"PeriodicalIF":2.5,"publicationDate":"2025-11-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145729476","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Effect of Die Shape and Size on Performance of GaN-Based Resonator Micro-LEDs 芯片形状和尺寸对氮化镓谐振腔微型led性能的影响
IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-11-25 DOI: 10.1109/LPT.2025.3636731
Chaoyu Lin;Junwei Hu;Hua Yang;Xiaoyan Yi;Jinmin Li;Liancheng Wang
Micro-LEDs is regarded as the next-generation revolutionary display technology due to its advantages such as long life, high efficiency, high brightness and high contrast. Yet its inherent Lambertian radiation characteristics and relatively broader emission spectrum result in low optical coupling efficiency and diffraction dispersion-related “rainbow” phenomenon when combined with a waveguide combiner in AR application. We have reported resonant cavity (RC) Micro-LEDs with a reduced divergence angle and narrow spectrum. This work further develops an optimized RC Micro-LEDs with a ITO shoulder, thus significantly improves the yield. Then RC Micro-LEDs with different die shape and size was systematically analyzed. Our work should advance the application of Micro-LED, especially for AR application.
micro - led由于具有长寿命、高效率、高亮度、高对比度等优点,被认为是下一代革命性的显示技术。然而,其固有的朗伯辐射特性和相对较宽的发射光谱导致其光耦合效率较低,在AR应用中与波导组合器结合使用时会出现与衍射色散相关的“彩虹”现象。我们报道了谐振腔(RC) Micro-LEDs,其发散角减小,光谱窄。这项工作进一步开发了一个优化的带有ITO肩的RC Micro-LEDs,从而显着提高了良率。然后对不同模具形状和尺寸的RC微型led进行了系统分析。我们的工作将推动Micro-LED的应用,特别是AR应用。
{"title":"Effect of Die Shape and Size on Performance of GaN-Based Resonator Micro-LEDs","authors":"Chaoyu Lin;Junwei Hu;Hua Yang;Xiaoyan Yi;Jinmin Li;Liancheng Wang","doi":"10.1109/LPT.2025.3636731","DOIUrl":"https://doi.org/10.1109/LPT.2025.3636731","url":null,"abstract":"Micro-LEDs is regarded as the next-generation revolutionary display technology due to its advantages such as long life, high efficiency, high brightness and high contrast. Yet its inherent Lambertian radiation characteristics and relatively broader emission spectrum result in low optical coupling efficiency and diffraction dispersion-related “rainbow” phenomenon when combined with a waveguide combiner in AR application. We have reported resonant cavity (RC) Micro-LEDs with a reduced divergence angle and narrow spectrum. This work further develops an optimized RC Micro-LEDs with a ITO shoulder, thus significantly improves the yield. Then RC Micro-LEDs with different die shape and size was systematically analyzed. Our work should advance the application of Micro-LED, especially for AR application.","PeriodicalId":13065,"journal":{"name":"IEEE Photonics Technology Letters","volume":"38 5","pages":"305-308"},"PeriodicalIF":2.5,"publicationDate":"2025-11-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145712558","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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IEEE Photonics Technology Letters
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