Kinetic liquid metal synthesis of flexible 2D conductive oxides for multimodal wearable sensing

IF 12.3 1区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC npj Flexible Electronics Pub Date : 2024-11-23 DOI:10.1038/s41528-024-00371-7
Md Saifur Rahman, Simon A. Agnew, Samuel W. Ong, William J. Scheideler
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Abstract

Transparent conducting oxides (TCOs) are crucial for high-performance displays, solar cells, and wearable sensors. However, their high process temperatures and brittle nature have hindered their use in flexible electronics. In this paper, we overturn these limitations by harnessing Cabrera-Mott oxidation to fabricate large-area, two-dimensional (2D) transparent electrodes via liquid metal printing. Our robotic, vacuum-free process deposits ultrathin (2–10 nm) indium tin oxide (ITO) with exceptional flexibility, transparency (>95%) and conductivity (>1300 S/cm) by utilizing hypoeutectic In-Sn alloys to print at <140 °C. Detailed characterization reveals the efficacy of Sn-doping and high crystallinity with large, platelike grains. The ultrathin nature enhances bending strain tolerance and scratch resistance, exceeding durability of PEDOT and offering low contact impedance to skin comparable to Ag/AgCl. We implement 2D ITO in synchronous, multimodal electrocardiography (ECG) and pulse plethysmography (PPG) measurements. This order-of-magnitude improvement to printed TCOs could enable wearable biometrics and display-integrated sensors.

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用于多模态可穿戴传感的柔性二维导电氧化物的动力学液态金属合成
透明导电氧化物(TCO)对于高性能显示器、太阳能电池和可穿戴传感器至关重要。然而,它们的加工温度高且易碎,阻碍了它们在柔性电子器件中的应用。在本文中,我们利用卡布雷拉-莫特氧化技术,通过液态金属印刷制造出大面积、二维(2D)透明电极,从而颠覆了这些限制。我们的机器人无真空工艺利用次共晶铟锡合金在 140 °C 下打印,沉积出超薄(2-10 nm)的氧化铟锡(ITO),具有优异的柔韧性、透明度(95%)和导电性(1300 S/cm)。详细的特性分析表明了掺杂锡的功效以及大晶粒、板状晶粒的高结晶性。其超薄特性增强了弯曲应变耐受性和抗划伤性,耐久性超过了 PEDOT,并提供了与 Ag/AgCl 相当的低皮肤接触阻抗。我们在同步多模态心电图(ECG)和脉搏胸压计(PPG)测量中使用了二维 ITO。这种对印刷 TCO 的数量级改进可实现可穿戴生物识别和显示集成传感器。
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来源期刊
CiteScore
17.10
自引率
4.80%
发文量
91
审稿时长
6 weeks
期刊介绍: npj Flexible Electronics is an online-only and open access journal, which publishes high-quality papers related to flexible electronic systems, including plastic electronics and emerging materials, new device design and fabrication technologies, and applications.
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