Improved surface quality components enabled by dual-laser additive/subtractive hybrid manufacturing process: Thermal behavior and ablation mechanisms

IF 4.6 2区 物理与天体物理 Q1 OPTICS Optics and Laser Technology Pub Date : 2024-11-19 DOI:10.1016/j.optlastec.2024.112147
Donghua Dai , Zhiheng Xia , Yuhang Long , Han Zhang , Jianye Liu , Zhenghua Huang , Keyu Shi
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Abstract

A high roughness of the laser powder bed fusion (LPBF) process has been one of the most concerned issues in the integrated fabrication of complicated metal parts. In this research, a dual (continuous and ultrafast) laser additive-subtractive hybrid manufacturing (LASHM) process is introduced to improve the surface quality of the LPBF-processed components. Effects of the laser subtractive times and the feed rates on the side surface morphology of the LASHM-processed AISI 316L components were studied. Meanwhile, the VOF transient physical model of LPBF and double temperature physical model of LASHM were established to investigate the individual thermal behaviors and the material melting-ablation mechanisms. For the LPBF process, the operating temperature of the molten pool bottom was firstly stable in 300 K (< 25 ms), then increased to 630 K (25 ms-35 ms) and finally exponentially increased to 3000 K (>35 ms), implying the delayed thermal effect. Meanwhile, the operating temperature of the top region was linearly increased to 2050 K. While for the ultrafast laser subtractive process, the operating temperature of the top region was remained at ∼ 300 K with the temperature rapid increase to 2900 K below 104 ps in the bottom region, leading to the direct material ablation and maintaining the LPBF-processed microstructure. At the laser subtractive times equal to four with the sequence feed rates of 10 μm, 10 μm, 8 μm and 6 μm, the surface roughness Sa and the maximum surface height difference Sz were considerably reduced from 10.774 μm and 73.387 μm to 1.933 μm and 18.151 μm.
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利用双激光增材/减材混合制造工艺提高部件表面质量:热行为和烧蚀机制
激光粉末床熔融(LPBF)工艺的高粗糙度一直是复杂金属零件集成制造中最受关注的问题之一。本研究引入了一种双(连续和超快)激光增材减材混合制造(LASHM)工艺,以改善 LPBF 加工部件的表面质量。研究了激光减法时间和进给量对 LASHM 加工的 AISI 316L 零件侧表面形貌的影响。同时,建立了 LPBF 的 VOF 瞬态物理模型和 LASHM 的双温物理模型,研究了各自的热行为和材料熔融烧蚀机理。在 LPBF 过程中,熔池底部的工作温度首先稳定在 300 K(25 ms),然后上升到 630 K(25 ms-35 ms),最后指数上升到 3000 K(35 ms),这意味着延迟热效应。而在超快激光减法过程中,顶部区域的工作温度保持在 300 K 左右,底部区域的温度在 104 ps 以下迅速升高到 2900 K,导致材料直接烧蚀并保持 LPBF 加工的微观结构。在 10 μm、10 μm、8 μm 和 6 μm 的顺序进给速率下,激光减法次数等于 4 时,表面粗糙度 Sa 和最大表面高度差 Sz 从 10.774 μm 和 73.387 μm 显著降低到 1.933 μm 和 18.151 μm。
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来源期刊
CiteScore
8.50
自引率
10.00%
发文量
1060
审稿时长
3.4 months
期刊介绍: Optics & Laser Technology aims to provide a vehicle for the publication of a broad range of high quality research and review papers in those fields of scientific and engineering research appertaining to the development and application of the technology of optics and lasers. Papers describing original work in these areas are submitted to rigorous refereeing prior to acceptance for publication. The scope of Optics & Laser Technology encompasses, but is not restricted to, the following areas: •development in all types of lasers •developments in optoelectronic devices and photonics •developments in new photonics and optical concepts •developments in conventional optics, optical instruments and components •techniques of optical metrology, including interferometry and optical fibre sensors •LIDAR and other non-contact optical measurement techniques, including optical methods in heat and fluid flow •applications of lasers to materials processing, optical NDT display (including holography) and optical communication •research and development in the field of laser safety including studies of hazards resulting from the applications of lasers (laser safety, hazards of laser fume) •developments in optical computing and optical information processing •developments in new optical materials •developments in new optical characterization methods and techniques •developments in quantum optics •developments in light assisted micro and nanofabrication methods and techniques •developments in nanophotonics and biophotonics •developments in imaging processing and systems
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