Xingyue Jin , Peng Zhao , Lin Li , Chengzhou Liu , Chuanwen Geng , Qifu Lin , Liqun Hu
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引用次数: 0
Abstract
Atmospheric pressure inductively coupled plasma (ICP) is widely applied in the production of high-purity coatings and powders. This paper innovatively presents a dual-band imaging ICP temperature diagnostic system that integrates visible light image processing technology and relative spectral line method. The system utilizes a dual-band imaging unit to simultaneously acquire monochromatic grayscale images of ICP at two different wavelengths using a single CCD camera. By establishing the correspondence between the emission intensity received by the emission spectrometer and the grayscale images recorded by the CCD camera, the two-dimensional (2D) electron excitation temperature (EET) field distribution of ICP is obtained by the relative spectral line method. The experimental results demonstrate that the maximum EET is located near to the center line of the RF-driven coil. Additionally, the EET in ICP decreases gradually from the center of the induction coil to the periphery. As the radio frequency (RF) power increases, the maximum EET also increases, and the high-temperature region expands. The accuracy of this method is validated by comparing it with the results obtained from the Boltzmann plot method. Therefore, this method can quickly obtain the transient EET field distribution of ICP, which is significant for optimizing the application of ICP in material processing.
期刊介绍:
Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences.
A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below.
The scope of the journal includes:
1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes).
2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis.
3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification.
4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.