{"title":"Feasibility and parametric study of a groove-type thermoelectric generator under multiphysics field conditions","authors":"Ding Luo , Zerui Liu , Jin Cao , Yuying Yan","doi":"10.1016/j.applthermaleng.2024.124972","DOIUrl":null,"url":null,"abstract":"<div><div>In this study, we propose a novel thermoelectric generator (TEG) configuration called the groove-type TEG, which introduces triangular brackets to increase the contact area between thermoelectric semiconductors and conductive strips. Through a thermal-electric-mechanical multiphysics numerical model, the performance of the groove-type TEG under various parameters is evaluated. Our findings reveal that the output power of the groove-type TEG can be effectively improved by increasing the length and height of the grooves, and the total height of the upper and lower grooves should be lower than the height of the thermoelectric semiconductor. Moreover, the groove height ratio and thermoelectric semiconductor height play crucial roles in determining the TEG’s performance and mechanical stability. Considering the allowable thermal stress, the optimal height ratio is 0.125 (or 0.875) when the semiconductor height is less than 1.2 mm (or greater than 1.3 mm). The groove-type TEG reaches the output power and conversion efficiency of 0.84 W and 6.9 %, respectively, at the temperature difference of 200 K and the semiconductor height of 1.3 mm, which are 24.8 % and 0.2 % higher than those of the traditional π-type TEG. This work provides a new approach to enhancing the performance of thermoelectric generators.</div></div>","PeriodicalId":8201,"journal":{"name":"Applied Thermal Engineering","volume":"259 ","pages":"Article 124972"},"PeriodicalIF":6.1000,"publicationDate":"2024-11-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Applied Thermal Engineering","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1359431124026401","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENERGY & FUELS","Score":null,"Total":0}
引用次数: 0
Abstract
In this study, we propose a novel thermoelectric generator (TEG) configuration called the groove-type TEG, which introduces triangular brackets to increase the contact area between thermoelectric semiconductors and conductive strips. Through a thermal-electric-mechanical multiphysics numerical model, the performance of the groove-type TEG under various parameters is evaluated. Our findings reveal that the output power of the groove-type TEG can be effectively improved by increasing the length and height of the grooves, and the total height of the upper and lower grooves should be lower than the height of the thermoelectric semiconductor. Moreover, the groove height ratio and thermoelectric semiconductor height play crucial roles in determining the TEG’s performance and mechanical stability. Considering the allowable thermal stress, the optimal height ratio is 0.125 (or 0.875) when the semiconductor height is less than 1.2 mm (or greater than 1.3 mm). The groove-type TEG reaches the output power and conversion efficiency of 0.84 W and 6.9 %, respectively, at the temperature difference of 200 K and the semiconductor height of 1.3 mm, which are 24.8 % and 0.2 % higher than those of the traditional π-type TEG. This work provides a new approach to enhancing the performance of thermoelectric generators.
期刊介绍:
Applied Thermal Engineering disseminates novel research related to the design, development and demonstration of components, devices, equipment, technologies and systems involving thermal processes for the production, storage, utilization and conservation of energy, with a focus on engineering application.
The journal publishes high-quality and high-impact Original Research Articles, Review Articles, Short Communications and Letters to the Editor on cutting-edge innovations in research, and recent advances or issues of interest to the thermal engineering community.