Raman activity, piezoelectric response, and carrier mobility in two-dimensional Janus TiGeZ3H (Z= N, P, As) semiconductors: A first-principles prediction

IF 4.2 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Materials Science in Semiconductor Processing Pub Date : 2024-11-19 DOI:10.1016/j.mssp.2024.109102
A.I. Kartamyshev , Nguyen N. Hieu , N.A. Poklonski , Nguyen V. Hieu , Tuan V. Vu , A.A. Lavrentyev , Huynh V. Phuc
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Abstract

In this article, we theoretically propose a series of TiGeZ3H (Z= N, P, As) monolayers and comprehensively investigate their structural, vibrational, piezoelectric, electronic, and transport properties using first-principles simulations. The structural stability of the suggested monolayers is verified by phonon dispersion analysis, ab-initio molecular dynamics calculations, and Born–Huang mechanical stability criteria. Based on the calculations for the mechanical response, it is shown that TiGeN3H is the stiffest material compared to the other two structures with Young’s modulus found to be 252.11 Nm−1. Besides, we also examine the vibrational characteristics of TiGeZ3H through the analysis of their phonon spectra and Raman active modes. Due to the broken vertical mirror symmetry, TiGeZ3H monolayers possess both out-of-plane and in-plane piezoelectric responses, in particular, the out-of-plane piezoelectric coefficient of TiGeAs3H is computed to be up to 0.42 pm/V. Janus TiGeZ3H monolayers are found to be indirect semiconductors with decreasing bandgap as Z changes from N to As. Particularly, the Rashba spin splitting is found in TiGeAs3H when the spin–orbit coupling is taken into account. The calculations for the transport features indicate that while TiGeN3H monolayer exhibits low electron mobility, both TiGeP3H and TiGeAs3H have electron mobility μx over 400 cm2V−1s−1, which is suitable for applications in electronics.
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二维 Janus TiGeZ3H(Z= N、P、As)半导体中的拉曼活性、压电响应和载流子迁移率:第一原理预测
本文从理论上提出了一系列 TiGeZ3H(Z= N、P、As)单层,并利用第一性原理模拟全面研究了它们的结构、振动、压电、电子和传输特性。通过声子色散分析、非原位分子动力学计算和 Born-Huang 力学稳定性标准,验证了所建议单层的结构稳定性。根据力学响应的计算结果,与其他两种结构相比,TiGeN3H 是最坚硬的材料,其杨氏模量为 252.11 Nm-1。此外,我们还通过分析 TiGeZ3H 的声子光谱和拉曼有效模式来研究其振动特性。由于垂直镜像对称性被打破,TiGeZ3H 单层具有面外和面内压电响应,尤其是 TiGeAs3H 的面外压电系数计算值高达 -0.42 pm/V。研究发现,Janus TiGeZ3H 单层是间接半导体,其带隙随着 Z 从 N 到 As 的变化而减小。特别是,当考虑到自旋轨道耦合时,在 TiGeAs3H 中发现了拉什巴自旋分裂。对传输特性的计算表明,虽然 TiGeN3H 单层的电子迁移率较低,但 TiGeP3H 和 TiGeAs3H 的电子迁移率 μx 均超过 400 cm2V-1s-1,适合应用于电子领域。
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来源期刊
Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing 工程技术-材料科学:综合
CiteScore
8.00
自引率
4.90%
发文量
780
审稿时长
42 days
期刊介绍: Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
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