Sintering behaviors, microstructure and properties of Li2O–Al2O3–SiO2 glass-ceramics for LTCC applications

IF 4.3 3区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Materials Chemistry and Physics Pub Date : 2024-11-16 DOI:10.1016/j.matchemphys.2024.130163
Shuo Tian , Hao Yang Shen , Jun Jie Huang , Hao Zhang , Kai Ge Liu , Bin He , Jianwei Zhao , Ling Bing Kong
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Abstract

When preparing glass-ceramics using sintering method, porosity is the main reason affecting their properties. To achieve glass-ceramics with low thermal expansion performance, cold isostatic pressing is adopted to significantly reduce the porosity. In this study, we systematically analyzed the effect of CaF2/CaO content on sintering behavior, microstructure and properties of Li2O–Al2O3–SiO2 (LAS) glass-ceramics. It was found that the [CaF2]/([CaO]+[CaF2]) ratio x can be used to regulate the coefficient of thermal expansion (CTE) of the LAS glass-ceramics. The optimized sample has a CTE of 2.2865 ppm/°C, which is compatible with that of silicon (2.5 ppm/°C). At the same time, low dielectric constant (5.95 ≤ εr ≤ 8.89) and dielectric loss (1.179 × 10−3 ≤ tanδ ≤2.871 × 10−2) were observed, which makes them a promising candidate for low-temperature co-fired ceramic substrate applications.
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用于 LTCC 应用的 Li2O-Al2O3-SiO2 玻璃陶瓷的烧结行为、微观结构和性能
使用烧结法制备玻璃陶瓷时,孔隙率是影响其性能的主要原因。为了获得热膨胀性能较低的玻璃陶瓷,采用冷等静压法可以显著降低孔隙率。本研究系统分析了 CaF2/CaO 含量对 Li2O-Al2O3-SiO2 (LAS) 玻璃陶瓷的烧结行为、微观结构和性能的影响。研究发现,[CaF2]/([CaO]+[CaF2])比 x 可用来调节 LAS 玻璃陶瓷的热膨胀系数(CTE)。优化样品的热膨胀系数为 2.2865 ppm/°C,与硅的热膨胀系数(2.5 ppm/°C)相当。同时,还观察到了较低的介电常数(5.95 ≤ εr ≤ 8.89)和介电损耗(1.179 × 10-3 ≤ tanδ ≤2.871 × 10-2),这使它们成为低温共烧陶瓷基底应用的理想候选材料。
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来源期刊
Materials Chemistry and Physics
Materials Chemistry and Physics 工程技术-材料科学:综合
CiteScore
8.70
自引率
4.30%
发文量
1515
审稿时长
69 days
期刊介绍: Materials Chemistry and Physics is devoted to short communications, full-length research papers and feature articles on interrelationships among structure, properties, processing and performance of materials. The Editors welcome manuscripts on thin films, surface and interface science, materials degradation and reliability, metallurgy, semiconductors and optoelectronic materials, fine ceramics, magnetics, superconductors, specialty polymers, nano-materials and composite materials.
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