Modulated ultrasound speakers – A common framework for analyzing air pump speakers

IF 4.1 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Sensors and Actuators A-physical Pub Date : 2024-11-28 DOI:10.1016/j.sna.2024.116086

Sagi Chen , Mikkel Harteg , Moti Margalit

引用次数: 0

Abstract

In this article we describe a new approach to sound generation based on active modulation of ultrasound. Active modulation of ultrasound provides an alternative to dynamic drivers and enables to reduce the size and volume of speakers. This feat in apparent contradiction to basic acoustics. In the article we provide for the first time an explanation of the underlying physics of modulated ultrasound speakers using a holistic lumped element model. Using the model, we explore different archiectures and highlight an archicture providing maximal sound pressure level for a given membrane area and displacement. Devices implementing the architecture were fabricated using MEMS technology. The sound pressure level response of the fabricated devices is compared to simulations highlighting the unique properties of the modulated ultrasound speakers.

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调制超声波扬声器--分析气泵扬声器的通用框架

在这篇文章中，我们介绍了一种基于超声波主动调制的新发声方法。超声波主动调制为动态驱动器提供了一种替代方案，并能减小扬声器的尺寸和体积。这一壮举显然与基本声学原理相悖。在这篇文章中，我们首次使用整体块状元素模型解释了调制超声扬声器的基本物理原理。利用该模型，我们探索了不同的结构，并重点介绍了在给定膜面积和位移条件下提供最大声压级的结构。采用 MEMS 技术制造了实现该结构的设备。制造设备的声压级响应与模拟进行了比较，突出了调制超声扬声器的独特性能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Sensors and Actuators A-physical 工程技术-工程：电子与电气

CiteScore

8.10

自引率

6.50%

发文量

630

审稿时长

49 days

期刊介绍： Sensors and Actuators A: Physical brings together multidisciplinary interests in one journal entirely devoted to disseminating information on all aspects of research and development of solid-state devices for transducing physical signals. Sensors and Actuators A: Physical regularly publishes original papers, letters to the Editors and from time to time invited review articles within the following device areas: • Fundamentals and Physics, such as: classification of effects, physical effects, measurement theory, modelling of sensors, measurement standards, measurement errors, units and constants, time and frequency measurement. Modeling papers should bring new modeling techniques to the field and be supported by experimental results. • Materials and their Processing, such as: piezoelectric materials, polymers, metal oxides, III-V and II-VI semiconductors, thick and thin films, optical glass fibres, amorphous, polycrystalline and monocrystalline silicon. • Optoelectronic sensors, such as: photovoltaic diodes, photoconductors, photodiodes, phototransistors, positron-sensitive photodetectors, optoisolators, photodiode arrays, charge-coupled devices, light-emitting diodes, injection lasers and liquid-crystal displays. • Mechanical sensors, such as: metallic, thin-film and semiconductor strain gauges, diffused silicon pressure sensors, silicon accelerometers, solid-state displacement transducers, piezo junction devices, piezoelectric field-effect transducers (PiFETs), tunnel-diode strain sensors, surface acoustic wave devices, silicon micromechanical switches, solid-state flow meters and electronic flow controllers. Etc...