The effect of temperature variation on the transient response of RF PIN diode limiters for very high frequency applications

IF 1.1 4区 计算机科学 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Iet Microwaves Antennas & Propagation Pub Date : 2024-09-09 DOI:10.1049/mia2.12508
Cornelius Johannes Botha, Tinus Stander
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Abstract

This work presents the effect of temperature change on the capacitance of silicon PIN diodes and the resulting change in performance of RF limiters at very high frequency (VHF). Device temperatures were varied between −25 ºC and 100 ºC, with small-signal parameters (including device capacitance) extracted at regular temperature increments and bias voltages from −20 Vdc to +3 Vdc using a multi-bias parameter extraction method. It was found that the junction capacitance of the four PIN diodes under investigation increases with temperature, as expected from carrier lifetime behaviour, while results also confirmed prior observations of an inverse relationship between forward-biased series resistance and temperature. Devices were subsequently tested in two different limiter topologies through high-power transient measurements. It was found that the combination of increased capacitance and decreased resistance with increasing temperature increases the transient spike leakage and decreases the flat leakage of a limiter. It was also concluded that, for VHF, an anti-parallel topology provides the best performance over a wide range of temperatures.

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温度变化对用于超高频应用的射频 PIN 二极管限幅器瞬态响应的影响
本研究介绍了温度变化对硅 PIN 二极管电容的影响,以及由此导致的甚高频 (VHF) 射频限幅器性能的变化。器件温度在 -25 ºC 和 100 ºC 之间变化,采用多偏置参数提取方法,在固定的温度增量和 -20 Vdc 至 +3 Vdc 的偏置电压下提取小信号参数(包括器件电容)。研究发现,所研究的四个 PIN 二极管的结电容随温度升高而增大,这与载流子寿命行为的预期相符,同时研究结果还证实了先前观察到的正向偏置串联电阻与温度之间的反比关系。随后,通过大功率瞬态测量,在两种不同的限幅器拓扑结构中对器件进行了测试。结果发现,随着温度的升高,电容增大,电阻减小,从而增加了瞬态尖峰泄漏,降低了限幅器的平坦泄漏。研究还得出结论,对于甚高频而言,反并联拓扑结构能在很宽的温度范围内提供最佳性能。
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来源期刊
Iet Microwaves Antennas & Propagation
Iet Microwaves Antennas & Propagation 工程技术-电信学
CiteScore
4.30
自引率
5.90%
发文量
109
审稿时长
7 months
期刊介绍: Topics include, but are not limited to: Microwave circuits including RF, microwave and millimetre-wave amplifiers, oscillators, switches, mixers and other components implemented in monolithic, hybrid, multi-chip module and other technologies. Papers on passive components may describe transmission-line and waveguide components, including filters, multiplexers, resonators, ferrite and garnet devices. For applications, papers can describe microwave sub-systems for use in communications, radar, aerospace, instrumentation, industrial and medical applications. Microwave linear and non-linear measurement techniques. Antenna topics including designed and prototyped antennas for operation at all frequencies; multiband antennas, antenna measurement techniques and systems, antenna analysis and design, aperture antenna arrays, adaptive antennas, printed and wire antennas, microstrip, reconfigurable, conformal and integrated antennas. Computational electromagnetics and synthesis of antenna structures including phased arrays and antenna design algorithms. Radiowave propagation at all frequencies and environments. Current Special Issue. Call for papers: Metrology for 5G Technologies - https://digital-library.theiet.org/files/IET_MAP_CFP_M5GT_SI2.pdf
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