Numerical exploration of heat transfer and friction factor in corrugated dual-pipe heat exchangers using SiO2 and CuO nanofluids

IF 5.1 3区 工程技术 Q2 ENERGY & FUELS Thermal Science and Engineering Progress Pub Date : 2024-12-01 DOI:10.1016/j.tsep.2024.103076
Prem Kumar Chaurasiya , Jatoth Heeraman , Anoop Pratap Singh , K. Sudha Madhuri , Vinod Kumar Sharma
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Abstract

Numerical simulations are conducted to explore influence of corrugation on internal tube surfaces of the double pipe heat exchanger (DPHE). The study comparing the performance of liquid water, SiO2 (Silicon dioxide) and CuO (Copper oxide) as working fluids, with CuO showing promising outcomes. The configuration employed for investigation are inner tube corrugated externally (ECIT) and inner tube corrugated internally (ICIT), at helix angles (α) of 15°, 20°, and 25° is analysed using k-ε turbulence model within a Reynolds number (Re) range of 4000 to 20,000 under constant temperature conditions along the tube wall. Insights is gained from numerical simulations on heat transfer coefficient, pressure drop, frictional loss, and heat transfer rate [HTR]. The results revealed that ECIT outperformed ICIT, particularly at α = 15°, with higher performance evaluation criteria (PEC). This investigation provides valuable insights for optimizing heat exchanger design and operation by emphasizing the importance of corrugations for improved efficiency in industrial heat transfer processes. This study reveals that using CuO nanofluid in corrugated double pipe heat exchangers significantly enhances heat transfer performance, with a maximum Nusselt number increase of up to 35 %, while maintaining superior friction factors and performance evaluation criteria (PEC) values ranging from 0.89 to 2.09 at varying Reynolds numbers.
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基于SiO2和CuO纳米流体的波纹双管换热器传热和摩擦系数数值研究
通过数值模拟研究了波纹对双管换热器内管表面的影响。该研究比较了液态水、SiO2(二氧化硅)和CuO(氧化铜)作为工质的性能,其中CuO表现出良好的效果。采用k-ε湍流模型分析了沿管壁在恒定温度条件下,螺旋角(α)分别为15°、20°和25°时的内管外波纹(ECIT)和内管内波纹(ICIT)结构。通过对传热系数、压降、摩擦损失和传热速率[HTR]的数值模拟,获得了新的见解。结果表明,ECIT在α = 15°时表现更好,具有更高的性能评价标准(PEC)。本研究通过强调波纹对提高工业传热过程效率的重要性,为优化热交换器的设计和操作提供了有价值的见解。研究表明,在波纹双管换热器中使用CuO纳米流体可以显著提高换热性能,在不同雷诺数下,Nusselt数最大可提高35%,同时保持了优异的摩擦因数和性能评价标准(PEC)值,范围在0.89 ~ 2.09之间。
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来源期刊
Thermal Science and Engineering Progress
Thermal Science and Engineering Progress Chemical Engineering-Fluid Flow and Transfer Processes
CiteScore
7.20
自引率
10.40%
发文量
327
审稿时长
41 days
期刊介绍: Thermal Science and Engineering Progress (TSEP) publishes original, high-quality research articles that span activities ranging from fundamental scientific research and discussion of the more controversial thermodynamic theories, to developments in thermal engineering that are in many instances examples of the way scientists and engineers are addressing the challenges facing a growing population – smart cities and global warming – maximising thermodynamic efficiencies and minimising all heat losses. It is intended that these will be of current relevance and interest to industry, academia and other practitioners. It is evident that many specialised journals in thermal and, to some extent, in fluid disciplines tend to focus on topics that can be classified as fundamental in nature, or are ‘applied’ and near-market. Thermal Science and Engineering Progress will bridge the gap between these two areas, allowing authors to make an easy choice, should they or a journal editor feel that their papers are ‘out of scope’ when considering other journals. The range of topics covered by Thermal Science and Engineering Progress addresses the rapid rate of development being made in thermal transfer processes as they affect traditional fields, and important growth in the topical research areas of aerospace, thermal biological and medical systems, electronics and nano-technologies, renewable energy systems, food production (including agriculture), and the need to minimise man-made thermal impacts on climate change. Review articles on appropriate topics for TSEP are encouraged, although until TSEP is fully established, these will be limited in number. Before submitting such articles, please contact one of the Editors, or a member of the Editorial Advisory Board with an outline of your proposal and your expertise in the area of your review.
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