{"title":"The influence of microgrooves on the dynamics of drop spreading on textured surfaces","authors":"S.V. Syrodoy, G.V. Kuznetsov, K.A. Voytkova, Zh.A. Kostoreva, N.Yu. Gutareva, A.S. Poznaharev, M.S. Tamashevich","doi":"10.1016/j.tsep.2024.103058","DOIUrl":null,"url":null,"abstract":"<div><div>In years of intensive development of electronic and microelectronic equipment, the problem of ensuring the scheduled thermal mode of both individual elements of such equipment and large-sized products, such as data storage databases, has become increasingly acute. Therefore, researchers from many countries are currently making active attempts to develop new systems for ensuring scheduled operating modes of electronic computer elements. One of the options for solving this problem is the drop cooling of surfaces of electronic and microelectronic equipment heated to high temperatures. This technology involves the formation of a cluster on the heat-removal surface of highly loaded computer elements. This allows extreme heat fluxes to be removed through phase change. However, despite a fairly large volume of research on this topic, there are still many unsolved problems in this area of knowledge. For example, the parameters (deposition height, drop feed rate, etc.) of water drop deposition on the surface of substrates used for cooling have not been determined yet. Moreover, the efficiency of drop cooling increases if the surface from which heat is removed is modified (roughness is formed). However, the patterns of spreading and evaporation of coolant drops on rough surfaces have not been sufficiently studied yet. Therefore, the aim of the work was to establish, based on the results of the experiments, the scale of the influence of the fall height of water drops on the characteristics and conditions of their spreading on a textured and polished surface. The paper presents the experimental results of the process of water drop impact on a textured surface. The main characteristics of a liquid drop spreading over a textured surface have been investigated. To establish the characteristics and conditions of spreading (drop spreading speed and time, drop shape stabilization time), typical shapes (in the midsection) of a drop spreading over the surface have been established. It is shown that the characteristic time of formation of the equilibrium state of the “water drop – substrate” system is no more than 0.1 s. This is significantly less than the drop evaporation time, even on high-temperature surfaces. The effect of surface anisotropy on the characteristics and conditions of spreading has been analyzed. It is shown that when water moves across the grooves, drop spreading is higher than along the grooves. A hypothesis has been developed to describe this effect.</div></div>","PeriodicalId":23062,"journal":{"name":"Thermal Science and Engineering Progress","volume":"56 ","pages":"Article 103058"},"PeriodicalIF":5.1000,"publicationDate":"2024-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Thermal Science and Engineering Progress","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2451904924006760","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENERGY & FUELS","Score":null,"Total":0}
引用次数: 0
Abstract
In years of intensive development of electronic and microelectronic equipment, the problem of ensuring the scheduled thermal mode of both individual elements of such equipment and large-sized products, such as data storage databases, has become increasingly acute. Therefore, researchers from many countries are currently making active attempts to develop new systems for ensuring scheduled operating modes of electronic computer elements. One of the options for solving this problem is the drop cooling of surfaces of electronic and microelectronic equipment heated to high temperatures. This technology involves the formation of a cluster on the heat-removal surface of highly loaded computer elements. This allows extreme heat fluxes to be removed through phase change. However, despite a fairly large volume of research on this topic, there are still many unsolved problems in this area of knowledge. For example, the parameters (deposition height, drop feed rate, etc.) of water drop deposition on the surface of substrates used for cooling have not been determined yet. Moreover, the efficiency of drop cooling increases if the surface from which heat is removed is modified (roughness is formed). However, the patterns of spreading and evaporation of coolant drops on rough surfaces have not been sufficiently studied yet. Therefore, the aim of the work was to establish, based on the results of the experiments, the scale of the influence of the fall height of water drops on the characteristics and conditions of their spreading on a textured and polished surface. The paper presents the experimental results of the process of water drop impact on a textured surface. The main characteristics of a liquid drop spreading over a textured surface have been investigated. To establish the characteristics and conditions of spreading (drop spreading speed and time, drop shape stabilization time), typical shapes (in the midsection) of a drop spreading over the surface have been established. It is shown that the characteristic time of formation of the equilibrium state of the “water drop – substrate” system is no more than 0.1 s. This is significantly less than the drop evaporation time, even on high-temperature surfaces. The effect of surface anisotropy on the characteristics and conditions of spreading has been analyzed. It is shown that when water moves across the grooves, drop spreading is higher than along the grooves. A hypothesis has been developed to describe this effect.
期刊介绍:
Thermal Science and Engineering Progress (TSEP) publishes original, high-quality research articles that span activities ranging from fundamental scientific research and discussion of the more controversial thermodynamic theories, to developments in thermal engineering that are in many instances examples of the way scientists and engineers are addressing the challenges facing a growing population – smart cities and global warming – maximising thermodynamic efficiencies and minimising all heat losses. It is intended that these will be of current relevance and interest to industry, academia and other practitioners. It is evident that many specialised journals in thermal and, to some extent, in fluid disciplines tend to focus on topics that can be classified as fundamental in nature, or are ‘applied’ and near-market. Thermal Science and Engineering Progress will bridge the gap between these two areas, allowing authors to make an easy choice, should they or a journal editor feel that their papers are ‘out of scope’ when considering other journals. The range of topics covered by Thermal Science and Engineering Progress addresses the rapid rate of development being made in thermal transfer processes as they affect traditional fields, and important growth in the topical research areas of aerospace, thermal biological and medical systems, electronics and nano-technologies, renewable energy systems, food production (including agriculture), and the need to minimise man-made thermal impacts on climate change. Review articles on appropriate topics for TSEP are encouraged, although until TSEP is fully established, these will be limited in number. Before submitting such articles, please contact one of the Editors, or a member of the Editorial Advisory Board with an outline of your proposal and your expertise in the area of your review.