Donghyeok Kim , Hanmin Oh , Jaeyeop Choi , Tan Hung Vo , Dinh Dat Vu , Sudip Mondal , Van Hiep Pham , Byeong-il Lee , Junghwan Oh
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引用次数: 0
Abstract
Scanning acoustic microscopy (SAM) is a useful tool for nondestructive inspection and provides inner structural information or defects that can adversely affect the product quality. Several SAM systems have been developed for application in various fields. Conventional SAM systems operate with a limited scanning range or long scanning time, which can cause inefficient economic and labor gains. Numerous studies have been conducted to reduce the scanning time, but these are too complicated or consume a large amount of time. In this study, a simple high-speed SAM system that provides high-quality images with high resolution within a short period of time is proposed. The scanning module is based on a single slider-crank and ball-screw mechanism to provide fast movement and low-cost development. When the system is operated at a high speed, the vibrations have a negative effect on the image quality. A stabilization process was applied to obtain high-quality images. Based on stress analysis, the main parts of the scanning module were optimized, and the counterweight was designed by applying simple mathematical modelling. To verify these vibration-reduction solutions, several samples were scanned using the developed high-speed SAM system. The obtained images successfully provided useful internal information and demonstrated the performance of the developed high-speed SAM system. Compared to other conventional SAM systems, the high-speed SAM system reduces the scanning time by approximately 77.2% with an acceptable scanning range, which shows its powerful application potential in various fields.
期刊介绍:
Engineering Science and Technology, an International Journal (JESTECH) (formerly Technology), a peer-reviewed quarterly engineering journal, publishes both theoretical and experimental high quality papers of permanent interest, not previously published in journals, in the field of engineering and applied science which aims to promote the theory and practice of technology and engineering. In addition to peer-reviewed original research papers, the Editorial Board welcomes original research reports, state-of-the-art reviews and communications in the broadly defined field of engineering science and technology.
The scope of JESTECH includes a wide spectrum of subjects including:
-Electrical/Electronics and Computer Engineering (Biomedical Engineering and Instrumentation; Coding, Cryptography, and Information Protection; Communications, Networks, Mobile Computing and Distributed Systems; Compilers and Operating Systems; Computer Architecture, Parallel Processing, and Dependability; Computer Vision and Robotics; Control Theory; Electromagnetic Waves, Microwave Techniques and Antennas; Embedded Systems; Integrated Circuits, VLSI Design, Testing, and CAD; Microelectromechanical Systems; Microelectronics, and Electronic Devices and Circuits; Power, Energy and Energy Conversion Systems; Signal, Image, and Speech Processing)
-Mechanical and Civil Engineering (Automotive Technologies; Biomechanics; Construction Materials; Design and Manufacturing; Dynamics and Control; Energy Generation, Utilization, Conversion, and Storage; Fluid Mechanics and Hydraulics; Heat and Mass Transfer; Micro-Nano Sciences; Renewable and Sustainable Energy Technologies; Robotics and Mechatronics; Solid Mechanics and Structure; Thermal Sciences)
-Metallurgical and Materials Engineering (Advanced Materials Science; Biomaterials; Ceramic and Inorgnanic Materials; Electronic-Magnetic Materials; Energy and Environment; Materials Characterizastion; Metallurgy; Polymers and Nanocomposites)