Improving thermoelectric properties of CuMnSb alloys via strategic alloying with magnetic MnSb and Cu

IF 2.7 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY Materials Letters Pub Date : 2025-02-15 Epub Date: 2024-11-28 DOI:10.1016/j.matlet.2024.137796
Jong Min Park, Seungki Jo, Soo-ho Jung, Jinhee Bae, Linh Ba Vu, Jihun Yu, Kyung Tae Kim
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Abstract

MnSb alloys are promising candidates for thermally stable magnetic materials in spintronic devices due to their high Curie temperature. When alloyed with transition metals, they hold potential as thermoelectric materials by adopting a half-Heusler structure. Among the few 3d transition metal-based compounds, CuMnSb alloys exhibit antiferromagnetic properties along with thermoelectric behavior. In this study, the CuMnSb alloy was synthesized using arc-melting, followed by powdering and spark plasma sintering. The thermoelectric properties were characterized in a temperature range of 298–673 K. The results indicate a significant improvement in the thermoelectric figure-of-merit (zT) of CuMnSb compared to MnSb, attributed to the increased power factor and reduced thermal conductivity through Cu alloying. These findings demonstrate the potential for obtaining half-Heusler-like thermoelectric materials by tailoring high-temperature magnetic materials.

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磁性微nsb与Cu策略性合金化改善CuMnSb合金热电性能
由于具有较高的居里温度,微nsb合金是自旋电子器件中热稳定磁性材料的有希望的候选材料。当与过渡金属合金化时,它们采用半赫斯勒结构,具有作为热电材料的潜力。在为数不多的三维过渡金属基化合物中,CuMnSb合金具有反铁磁性和热电性。本研究采用电弧熔炼、粉末化和火花等离子烧结的方法合成了CuMnSb合金。在298 ~ 673 K的温度范围内对其热电性能进行了表征。结果表明,与MnSb相比,CuMnSb的热电性能系数(zT)有显著改善,这是由于Cu合金增加了功率因数,降低了导热系数。这些发现证明了通过剪裁高温磁性材料获得半赫斯勒样热电材料的潜力。
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来源期刊
Materials Letters
Materials Letters 工程技术-材料科学:综合
CiteScore
5.60
自引率
3.30%
发文量
1948
审稿时长
50 days
期刊介绍: Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review. Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials. Contributions include, but are not limited to, a variety of topics such as: • Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors • Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart • Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction • Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots. • Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing. • Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic • Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive
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