Dao Wang , Yan Zhang , Yongbin Guo , Zhenzhen Shang , Danfeng He
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引用次数: 0
Abstract
The successful integration of Hf0.5Zr0.5O2 (HZO) ferroelectric (FE) thin film into memory devices necessitates addressing the challenges associated with achieving high remanent polarization (Pr) and low leakage current, in order to ensure excellent reliability. The limitations of HZO film are overcome in this paper through the design of a Pt/W bilayer electrode, wherein a thin Pt metallic layer (ML) is embedded at the top interface of the W/HZO/W capacitor. This innovative approach combines the unique advantages offered by both W and Pt electrodes. The results reveal that the 2Pr values of the W/HZO/5 Pt/W and W/HZO/10 Pt/W capacitors, with Pt ML thicknesses of 5 nm and 10 nm, respectively, are slightly lower at 42.1 μC/cm2 and 35.9 μC/cm2 compared to the reference W/HZO/W capacitor's value of 47.9 μC/cm2. This notwithstanding, these 2Pr values still maintain comparability with previously reported findings. Moreover, compared to the reference W/HZO/W capacitor, the W/HZO/10 Pt/W capacitor exhibits a reduction of one order of magnitude in leakage current, a 30 % increase in breakdown field from 3.0 MV/cm to 3.9 MV/cm, and an improvement of one order of magnitude in endurance performance, reaching 1.3 × 108 cycles. This improvement can be attributed to the incorporation of a thin Pt ML, which enhances the schottky barrier and prevents potential oxidation of adjacent W electrode near the HZO film, effectively alleviating the leakage current. The present work demonstrates the successful mitigation of leakage current and improved fatigue properties while preserving FE characteristics through strategic insertion of Pt ML. The research findings can offer valuable scientific guidance for optimizing the performance of HZO-based devices.
期刊介绍:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
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Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.