Improved leakage and fatigue properties of W/Hf0.5Zr0.5O2/W capacitor through the insertion of Pt metallic layer

IF 4.6 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Materials Science in Semiconductor Processing Pub Date : 2025-03-15 Epub Date: 2024-11-29 DOI:10.1016/j.mssp.2024.109165
Dao Wang , Yan Zhang , Yongbin Guo , Zhenzhen Shang , Danfeng He
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Abstract

The successful integration of Hf0.5Zr0.5O2 (HZO) ferroelectric (FE) thin film into memory devices necessitates addressing the challenges associated with achieving high remanent polarization (Pr) and low leakage current, in order to ensure excellent reliability. The limitations of HZO film are overcome in this paper through the design of a Pt/W bilayer electrode, wherein a thin Pt metallic layer (ML) is embedded at the top interface of the W/HZO/W capacitor. This innovative approach combines the unique advantages offered by both W and Pt electrodes. The results reveal that the 2Pr values of the W/HZO/5 Pt/W and W/HZO/10 Pt/W capacitors, with Pt ML thicknesses of 5 nm and 10 nm, respectively, are slightly lower at 42.1 μC/cm2 and 35.9 μC/cm2 compared to the reference W/HZO/W capacitor's value of 47.9 μC/cm2. This notwithstanding, these 2Pr values still maintain comparability with previously reported findings. Moreover, compared to the reference W/HZO/W capacitor, the W/HZO/10 Pt/W capacitor exhibits a reduction of one order of magnitude in leakage current, a 30 % increase in breakdown field from 3.0 MV/cm to 3.9 MV/cm, and an improvement of one order of magnitude in endurance performance, reaching 1.3 × 108 cycles. This improvement can be attributed to the incorporation of a thin Pt ML, which enhances the schottky barrier and prevents potential oxidation of adjacent W electrode near the HZO film, effectively alleviating the leakage current. The present work demonstrates the successful mitigation of leakage current and improved fatigue properties while preserving FE characteristics through strategic insertion of Pt ML. The research findings can offer valuable scientific guidance for optimizing the performance of HZO-based devices.
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通过Pt金属层的插入改善了W/Hf0.5Zr0.5O2/W电容器的泄漏和疲劳性能
为了将Hf0.5Zr0.5O2 (HZO)铁电(FE)薄膜成功集成到存储器件中,必须解决与实现高剩余极化(Pr)和低泄漏电流相关的挑战,以确保出色的可靠性。本文通过设计一种Pt/W双层电极,克服了HZO薄膜的局限性,在W/HZO/W电容器的顶部界面嵌入了一层薄薄的Pt金属层(ML)。这种创新的方法结合了W和Pt电极的独特优势。结果表明,Pt ML厚度分别为5 nm和10 nm的W/HZO/5 Pt/W和W/HZO/10 Pt/W电容器的2Pr值分别为42.1 μC/cm2和35.9 μC/cm2,略低于参考W/HZO/W电容器的47.9 μC/cm2。尽管如此,这些2Pr值仍然与先前报道的结果保持可比性。此外,与参考W/HZO/W电容器相比,W/HZO/ 10pt /W电容器的泄漏电流降低了一个数量级,击穿场从3.0 MV/cm增加到3.9 MV/cm,提高了30%,持久性能提高了一个数量级,达到1.3 × 108次循环。这种改进可以归因于薄Pt ML的掺入,它增强了肖特基势垒,防止了HZO膜附近相邻W电极的潜在氧化,有效地减轻了泄漏电流。本工作表明,通过战略性地插入Pt ML,成功地缓解了泄漏电流,改善了疲劳性能,同时保持了有限元特性。研究结果可以为优化基于hzo的器件的性能提供有价值的科学指导。
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来源期刊
Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing 工程技术-材料科学:综合
CiteScore
8.00
自引率
4.90%
发文量
780
审稿时长
42 days
期刊介绍: Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
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