“M”-Shaped Threshold Voltage Shift Induced by Competitive Positive/Negative Gate Switching Stress in Schottky-Type p-GaN Gate HEMTs

IF 4.5 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Electron Device Letters Pub Date : 2024-10-14 DOI:10.1109/LED.2024.3480253
Yunfeng Hu;Liang He;Meng Dong;Xinghuan Chen;Yijun Shi;Zhiyuan He;Zongqi Cai;Yiqiang Ni;Hongyue Wang;Zhizhe Wang;Yuan Li;Xiaoli Lu;Yuan Chen;Yiqiang Chen
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Abstract

This work investigates the threshold voltage ( ${V}_{\text {th}}\text {)}$ instability in Schottky-type p-GaN gate HEMTs subjected to positive/negative gate switching stress. Under the gate switching stress, a characteristic “M”-shaped ${V}_{\text {th}}$ curve with elevated ${V}_{\text {GS,ON}}$ is revealed. This pattern is ascribed to the competitive transport of electrons and holes. Considering the condition of reduced ${V}_{\text {GS, OFF}}$ , an increasing ${V} _{\text {th}}$ has also been observed, which is attributed to the curtailed electron emission while the promoted hole release. Further, with the increasing of the duty cycle, a positive ${V}_{\text {th}}$ shift at the lower ${V}_{\text {GS, ON}}$ and a negative shift at higher ${V}_{\text {GS, ON}}$ are needs to be taken seriously, and it also confirm the competitive mechanism in the abnormal “M”-shaped ${V}_{\text {th}}$ instability. The research highlights that the impact of positive/negative gate switching stress on ${V}_{\text {th}}$ instability are significant and cannot be neglected.
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schottky型p-GaN栅极hemt中竞争性正/负栅极开关应力诱导的“M”型阈值电压偏移
本文研究了schottky型p-GaN栅极hemt在正/负栅极开关应力作用下的阈值电压(${V}_{\text {th}}\text{)}$的不稳定性。在栅极开关应力作用下,呈现出${V}_{\text {th}}$升高的特征“M”形${V}_{\text {GS,ON}}$曲线。这种模式归因于电子和空穴的竞争输运。考虑到${V}_{\text {GS, OFF}}$减小的情况,也观察到${V}_{\text {th}}$增大,这是由于电子发射减少而空穴释放加快所致。进一步,随着占空比的增大,需要重视${V}_{\text {th}}$在较低${V}_{\text {GS, ON}}$处的正偏移和较高${V}_{\text {GS, ON}}$处的负偏移,这也证实了${V}_{\text {th}}$异常“M”形不稳定性中的竞争机制。研究表明,正/负栅极开关应力对${V}_{\text {th}}$不稳定性的影响是显著的,不可忽视。
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来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
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