A Review on Gate Oxide Failure Mechanisms of Silicon Carbide Semiconductor Devices

IF 3.2 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2024-10-25 DOI:10.1109/TED.2024.3482252
Jinglin Li;Aditya Shekhar;Willem D. van Driel;Guoqi Zhang
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Abstract

In this article, we provide a comprehensive review of defect formation at the atomic level in interfaces and gate oxides, focusing on two primary defect types: interface traps and oxide traps. We summarize the current theoretical models and experimental observations related to these intrinsic defects, as they critically impact device performance and reliability. By integrating theoretical insights with experimental data, this review provides a thorough understanding of the atomic-scale interactions that govern defect formation.
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碳化硅半导体器件栅氧化失效机理研究进展
在这篇文章中,我们提供了在界面和栅极氧化物的原子水平上缺陷形成的全面回顾,重点关注两种主要缺陷类型:界面陷阱和氧化物陷阱。我们总结了目前与这些内在缺陷相关的理论模型和实验观察,因为它们严重影响器件的性能和可靠性。通过将理论见解与实验数据相结合,本综述提供了对控制缺陷形成的原子尺度相互作用的透彻理解。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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