A Broadband and Transient-Accurate AlGaN/GaN HEMT SPICE Model for X-Band RF Applications

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2024-11-11 DOI:10.1109/TED.2024.3487959
Raghvendra Dangi;Ahtisham Pampori;Praveen Pal;Mohammad Sajid Nazir;Pragya Kushwaha;Yogesh Singh Chauhan
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Abstract

Dispersive effects such as trapping play a vital role in determining the performance of AlGaN/gallium nitride (GaN) high-electron mobility transistors (HEMTs) for RF and power applications—necessitating accurate modeling for robust circuit designs. This work presents a rigorous SPICE model to capture the transient and large-signal impact of traps in AlGaN/GaN HEMTs. The model has been implemented in the industry-standard ASM-HEMT compact-model framework. The model accurately accounts for the variation in threshold voltage and change in 2DEG charge carrier concentration in the source- and drain-side access regions under various drain-lag and gate-lag quiescent conditions. Threshold voltage and 2DEG charge carrier concentration at the source- and drain-side access regions show a linear dependence on drain-lag and gate-lag quiescent conditions, respectively. The results obtained using the developed model are in good agreement with the measured data. This model is valid for transient current simulations at different quiescent conditions and accurately captures the large-signal behavior at the optimal load impedance. Finally, pulsed IV characteristics at different temperatures have been validated against device measurements.
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用于x波段射频应用的宽带瞬态精确AlGaN/GaN HEMT SPICE模型
色散效应(如捕获)在决定用于射频和功率应用的AlGaN/氮化镓(GaN)高电子迁移率晶体管(hemt)的性能方面起着至关重要的作用,需要精确的建模来实现稳健的电路设计。这项工作提出了一个严格的SPICE模型,以捕捉AlGaN/GaN hemt中陷阱的瞬态和大信号影响。该模型已在行业标准ASM-HEMT紧凑型模型框架中实现。该模型准确地描述了在各种漏极滞后和门极滞后静态条件下源极和漏极侧通路区域阈值电压的变化和2°g载流子浓度的变化。源极和漏极入口区域的阈值电压和2℃载流子浓度分别与漏极滞后和栅极滞后静态条件呈线性关系。所建模型的计算结果与实测数据吻合较好。该模型适用于不同静态条件下的瞬态电流模拟,并能准确捕捉最佳负载阻抗下的大信号行为。最后,脉冲IV特性在不同的温度已经验证了设备测量。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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