A review of the mechanism and optimization of metal-assisted chemical etching and applications in semiconductors

IF 4.7 Q2 NANOSCIENCE & NANOTECHNOLOGY Micro and Nano Systems Letters Pub Date : 2024-12-11 DOI:10.1186/s40486-024-00217-x
Kibum Jung, Jungchul Lee
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Abstract

Metal-Assisted Chemical Etching (MACE) is a technique for precisely forming nanostructures on semiconductor substrates, and it is actively researched in various fields such as electronic devices, optoelectronic devices, energy storage, and conversion systems. This process offers economic efficiency and effectiveness because it can be performed in a simple chemical laboratory environment without the need for expensive equipment. Particularly, MACE is recognized as an excellent technology for forming various nanostructures due to its advantage of precisely controlling the shape, size, and orientation of nanostructures compared to traditional etching techniques. MACE operates by inducing electrochemical reactions using a metal catalyst, selectively etching the semiconductor surface in a mixed solution of hydrofluoric acid (HF) and hydrogen peroxide (\(\hbox {H}_2\hbox {O}_2\)). The metal catalyst reacts with the oxidant to generate holes, which are injected into the semiconductor substrate to promote oxidation reactions. The oxidized material is then dissolved by HF, progressing the etching process. Precise nanostructures are formed only in the areas with the metal catalyst, and the etching results vary depending on the type, thickness, and deposition method of the catalyst. In this study, we comprehensively review the mechanism of the MACE process, the patterns of nanostructure formation according to the characteristics of catalysts and substrates, and the influence of process variables. We also analyze application cases of MACE in various semiconductor substrates such as silicon (Si), germanium (Ge), indium phosphide (InP), and gallium arsenide (GaAs), and examine the latest research trends and applications utilizing MACE. Nanostructures formed through MACE have the potential to maximize the performance of next-generation semiconductor and optoelectronic devices, and research in this area is expected to greatly contribute to the future development of the semiconductor industry.

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综述了金属辅助化学蚀刻的机理、优化及其在半导体中的应用
金属辅助化学蚀刻(Metal-Assisted Chemical Etching, MACE)是一种在半导体基底上精确形成纳米结构的技术,在电子器件、光电器件、储能和转换系统等领域得到了积极的研究。该过程提供了经济效率和有效性,因为它可以在简单的化学实验室环境中进行,而不需要昂贵的设备。特别是,与传统的蚀刻技术相比,MACE具有精确控制纳米结构的形状、尺寸和方向的优势,被认为是形成各种纳米结构的一种优秀技术。MACE的工作原理是使用金属催化剂诱导电化学反应,选择性地在氢氟酸(HF)和过氧化氢的混合溶液中蚀刻半导体表面(\(\hbox {H}_2\hbox {O}_2\))。所述金属催化剂与氧化剂发生反应生成空穴,所述空穴注入半导体衬底以促进氧化反应。然后用HF溶解被氧化的材料,进行蚀刻过程。精确的纳米结构只在有金属催化剂的区域形成,蚀刻结果取决于催化剂的类型、厚度和沉积方法。在本研究中,我们全面回顾了MACE工艺的机理,根据催化剂和底物的特点,纳米结构的形成模式,以及工艺变量的影响。我们还分析了MACE在硅(Si)、锗(Ge)、磷化铟(InP)和砷化镓(GaAs)等各种半导体衬底中的应用案例,并探讨了MACE的最新研究趋势和应用。通过MACE形成的纳米结构有可能最大限度地提高下一代半导体和光电子器件的性能,这一领域的研究有望为半导体产业的未来发展做出巨大贡献。
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来源期刊
Micro and Nano Systems Letters
Micro and Nano Systems Letters Engineering-Biomedical Engineering
CiteScore
10.60
自引率
5.60%
发文量
16
审稿时长
13 weeks
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