Single Proof Mass Resonant MEMS Accelerometer With Parallel Motion Linkage Amplifier

IF 2.2 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Sensors Letters Pub Date : 2024-11-27 DOI:10.1109/LSENS.2024.3507075
Alexandra Zobova;Maxim Drizovsky;Omer HaLevy;Neta Melech;Shmuel Livne;Slava Krylov
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Abstract

We report on a new architecture and theoretical and experimental feasibility study of a resonant accelerometer, combining a robust single proof mass (PM) design with a compliant parallel motion linkage-type force amplifier. The device, incorporating four effectively oblique force-transmitting links and a resonant sensing beam attached at its ends to two shutters, is distinguished by a simple, manufacturable geometry, purely axial, free from any bending, loading of the vibrating sensing beam, and low parasitic compliance. The device was fabricated from the 25 $\mu$ m thick layer of a silicon-on-insulator (SOI) wafer. The acceleration-dependent frequency of the electrostatically driven 300 $\mu$ m long and 3.8 $\mu$ m wide resonator was measured using capacitive sensing, combined with open or closed-loop excitation scenarios. Consistently with the lumped and the full scale FE models prediction, 760 Hz/g sensitivity of the device, with the $\approx$ 2600 × 2600 $\mu$ m PM, was demonstrated during the $\pm g$ experiment.
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带并联运动联动放大器的单防质量谐振MEMS加速度计
我们报告了一种谐振加速度计的新结构和理论和实验可行性研究,结合了鲁棒的单证明质量(PM)设计和兼容的并联运动链接型力放大器。该装置包括四个有效的倾斜力传输链接和两端连接到两个百叶窗的谐振传感梁,其特点是简单,可制造的几何形状,纯轴向,无任何弯曲,振动传感梁的负载,低寄生顺应性。该器件由25 $\mu$ m厚的绝缘体上硅(SOI)晶圆片制成。采用电容式传感测量了300 $\mu$ m长、3.8 $\mu$ m宽的静电驱动谐振器的加速度相关频率,并结合开环和闭环激励方案进行了测量。与集总和全尺度有限元模型的预测一致,在$\pm g$实验中,该装置在$\approx$ 2600 × 2600 $\mu$ m PM下的灵敏度为760 Hz/g。
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来源期刊
IEEE Sensors Letters
IEEE Sensors Letters Engineering-Electrical and Electronic Engineering
CiteScore
3.50
自引率
7.10%
发文量
194
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Table of Contents Front Cover IEEE Sensors Council Information IEEE Sensors Letters Subject Categories for Article Numbering Information IEEE Sensors Letters Publication Information
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