Casper Cromjongh;Yongding Tian;H. Peter Hofstee;Zaid Al-Ars
{"title":"Hardware-Accelerator Design by Composition: Dataflow Component Interfaces With Tydi-Chisel","authors":"Casper Cromjongh;Yongding Tian;H. Peter Hofstee;Zaid Al-Ars","doi":"10.1109/TVLSI.2024.3461330","DOIUrl":null,"url":null,"abstract":"As dedicated hardware is becoming more prevalent in accelerating complex applications, methods are needed to enable easy integration of multiple hardware components into a single accelerator system. However, this vision of composable hardware is hindered by the lack of standards for interfaces that allow such components to communicate. To address this challenge, the Tydi standard was proposed to facilitate the representation of streaming data in digital circuits, notably providing interface specifications of composite and variable-length data structures. At the same time, constructing hardware in a Scala embedded language (Chisel) provides a suitable environment for deploying Tydi-centric components due to its abstraction level and customizability. This article introduces Tydi-Chisel, a library that integrates the Tydi standard within Chisel, along with a toolchain and methodology for designing data-streaming accelerators. This toolchain reduces the effort needed to design streaming hardware accelerators by raising the abstraction level for streams and module interfaces, hereby avoiding writing boilerplate code, and allows for easy integration of accelerator components from different designers. This is demonstrated through an example project incorporating various scenarios where the interface-related declaration is reduced by 6–14 times. Tydi-Chisel project repository is available at \n<uri>https://github.com/abs-tudelft/Tydi-Chisel</uri>\n.","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":"32 12","pages":"2281-2292"},"PeriodicalIF":2.8000,"publicationDate":"2024-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10705101/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0
Abstract
As dedicated hardware is becoming more prevalent in accelerating complex applications, methods are needed to enable easy integration of multiple hardware components into a single accelerator system. However, this vision of composable hardware is hindered by the lack of standards for interfaces that allow such components to communicate. To address this challenge, the Tydi standard was proposed to facilitate the representation of streaming data in digital circuits, notably providing interface specifications of composite and variable-length data structures. At the same time, constructing hardware in a Scala embedded language (Chisel) provides a suitable environment for deploying Tydi-centric components due to its abstraction level and customizability. This article introduces Tydi-Chisel, a library that integrates the Tydi standard within Chisel, along with a toolchain and methodology for designing data-streaming accelerators. This toolchain reduces the effort needed to design streaming hardware accelerators by raising the abstraction level for streams and module interfaces, hereby avoiding writing boilerplate code, and allows for easy integration of accelerator components from different designers. This is demonstrated through an example project incorporating various scenarios where the interface-related declaration is reduced by 6–14 times. Tydi-Chisel project repository is available at
https://github.com/abs-tudelft/Tydi-Chisel
.
期刊介绍:
The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.
Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels.
To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.