{"title":"Analog Probe Module (APM) for Enhanced IC Observability: From Concept to Application","authors":"Anshaj Shrivastava;Gaurab Banerjee","doi":"10.1109/TVLSI.2024.3470342","DOIUrl":null,"url":null,"abstract":"This study presents a compact, on-chip analog probe module (APM) to augment the IEEE 1149.4 (or P1687.2) standard for efficiently probing multiple internal nodes. The complete approach to APM implementation, from conceptualization to practical application, is discussed in detail. The APM aims to utilize a minimum area for a maximum number of probe channels, achieving an optimal size of 4:15. At the transistor level, the design minimizes the impact of glitches in asynchronous operations through a symmetrical layout and a unique arrangement of all probe channels. However, glitches in asynchronous circuits can still exist; hence, a state transition matrix (STM) concept is devised. STMs help visualize hazardous transitions, allowing the identification of a common hazard-free transition sequence suitable for hardware implementation. The verified APM design is integrated with several analog/RF circuits fabricated in a commercially available 0.18-\n<inline-formula> <tex-math>$\\mu $ </tex-math></inline-formula>\nm RF-CMOS process as part of a radar-on-chip system. An important APM application of enabling the prediction of an IC’s corner disposition by measuring dc-node voltages during postsilicon IC testing is demonstrated for 16 fabricated ICs.","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":"32 12","pages":"2355-2367"},"PeriodicalIF":2.8000,"publicationDate":"2024-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10710155/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0
Abstract
This study presents a compact, on-chip analog probe module (APM) to augment the IEEE 1149.4 (or P1687.2) standard for efficiently probing multiple internal nodes. The complete approach to APM implementation, from conceptualization to practical application, is discussed in detail. The APM aims to utilize a minimum area for a maximum number of probe channels, achieving an optimal size of 4:15. At the transistor level, the design minimizes the impact of glitches in asynchronous operations through a symmetrical layout and a unique arrangement of all probe channels. However, glitches in asynchronous circuits can still exist; hence, a state transition matrix (STM) concept is devised. STMs help visualize hazardous transitions, allowing the identification of a common hazard-free transition sequence suitable for hardware implementation. The verified APM design is integrated with several analog/RF circuits fabricated in a commercially available 0.18-
$\mu $
m RF-CMOS process as part of a radar-on-chip system. An important APM application of enabling the prediction of an IC’s corner disposition by measuring dc-node voltages during postsilicon IC testing is demonstrated for 16 fabricated ICs.
期刊介绍:
The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.
Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels.
To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.