{"title":"Quasi-Adiabatic Clock Networks in 3-D Voltage Stacked Systems","authors":"Andres Ayes;Eby G. Friedman","doi":"10.1109/TVLSI.2024.3448374","DOIUrl":null,"url":null,"abstract":"Power delivery in three-dimensional (3-D) integrated systems poses several challenges such as high current densities, large voltage drops due to multiple levels of resistive vertical interconnect, and significant switching noise originating from transient currents within different layers. Voltage stacking is a power delivery technique that is highly compatible with 3-D integration due to the physical proximity between layers, enabling the efficient transfer of recycled current. Power noise in clock networks is, however, not inherently addressed by 3-D voltage stacking. In this brief, a quasi-adiabatic technique between multiple clock networks within 3-D voltage stacked systems is proposed. The technique exploits the proximity of the clock networks to enable mutual charging and discharging when the clock signals transition to the same voltage. During this transition, the clock distribution networks are isolated from the power grid, reducing simultaneous switching noise and current load. The maximum current is reduced by an additional 13% as compared to only voltage stacking, the maximum voltage noise is reduced by up to 72% when the clock networks are isolated from the power grids, and the clock networks pull nearly 50% less charge from the source. The proposed technique is evaluated on a 7 nm predictive technology model.","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":"32 12","pages":"2394-2397"},"PeriodicalIF":2.8000,"publicationDate":"2024-09-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10684299/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0
Abstract
Power delivery in three-dimensional (3-D) integrated systems poses several challenges such as high current densities, large voltage drops due to multiple levels of resistive vertical interconnect, and significant switching noise originating from transient currents within different layers. Voltage stacking is a power delivery technique that is highly compatible with 3-D integration due to the physical proximity between layers, enabling the efficient transfer of recycled current. Power noise in clock networks is, however, not inherently addressed by 3-D voltage stacking. In this brief, a quasi-adiabatic technique between multiple clock networks within 3-D voltage stacked systems is proposed. The technique exploits the proximity of the clock networks to enable mutual charging and discharging when the clock signals transition to the same voltage. During this transition, the clock distribution networks are isolated from the power grid, reducing simultaneous switching noise and current load. The maximum current is reduced by an additional 13% as compared to only voltage stacking, the maximum voltage noise is reduced by up to 72% when the clock networks are isolated from the power grids, and the clock networks pull nearly 50% less charge from the source. The proposed technique is evaluated on a 7 nm predictive technology model.
期刊介绍:
The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.
Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels.
To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.