High Signal Integrity Interconnects Embedded With Metasurface for Far-End Crosstalk Reduction and High-Speed Data Transfer

Abstract

This article proposes a novel structure of coupled line with embedded metasurface aimed at mitigating far-end crosstalk (FEXT) in high-speed data transmission. The square loop metasurface structure is implemented under the coupled line to increase the mutual capacitance between signal traces, thereby mitigating FEXT in the coupled line. The capacitance and the inductance matrices of both conventional coupled line and the proposed metasurface-embedded structure are extracted with numerical equations from the simulations and applied to the equivalent circuit model to comprehensively analyze and accurately evaluate the proposed structure. To validate the design efficacy of the proposed concept, prototypes of conventional and the proposed coupled line structure are implemented on a FR-4 printed circuit board, and their performance in both frequency domain and time domain are measured and compared. Compared to conventional coupled line, experimental results demonstrate that the proposed metasurface embedded coupled line structure significantly enhances the FEXT performance while ensuring robust high-speed signal propagation along the signal traces. Specifically, FEXT is reduced by 8.2 dB within the frequency range of 1–12 GHz, and with the largest improvement of 42.84 dB at 10.9 GHz. This superior FEXT performance coupled with ultra-low latency underscores the significant potential of the proposed metasurface embedded coupled line structure for application in miniaturized high-speed systems.