Pengfei Liu, Xuetao Cheng, Huilin Zhao, Fenghua Bai, Yan-Qin Wang
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引用次数: 0
Abstract
Electrocatalytic nitrate reduction (ENO3RR) for ammonia production is one of the potential alternatives to Haber–Bosch technology for the realization of artificial ammonia synthesis. However, efficient ammonia production remains challenging due to the complex electron transfer process in ENO3RR. In this study, we fabricated a Cu3P/CoP heterostructure on carbon cloth (CC) by electrodeposition and vapor deposition, which exhibits an exceptional ENO3RR performance in alkaline medium, and showcases a Faradaic efficiency of ammonia (FENH3) and an ammonia yield rate as high as 97.95% and 17,637.3 μg h–1 cm–2 at −0.9 V vs RHE. Moreover, Cu3P/CoP also has excellent catalytic activity for nitrite reduction to ammonia, with an FENH3 up to 98.31% at −0.7 V vs RHE. The experimental and theoretical calculations reveal and confirm that the formation of a heterogeneous interface between Cu3P and CoP effectively promotes the electron transfer, where Cu3P as an electron donor induces the decrease of electron density around Cu and results in an enhancement of NO2– adsorption, thereby accelerating the ENO3RR process while inhibiting the competitive hydrogen evolution reaction (HER). Moreover, the metal phosphide catalyst facilitates the water dissociation, which accelerates the abundant *H generation, thus enhancing the subsequent hydrogenation process toward ENO3RR.
电催化硝酸还原(ENO3RR)制氨技术是实现人工氨合成的潜在替代技术之一。然而,由于en3rr中复杂的电子转移过程,高效的氨生产仍然具有挑战性。在本研究中,我们通过电沉积和气相沉积在碳布(CC)上制备了Cu3P/CoP异质结构,该异质结构在碱性介质中具有优异的en3rr性能,在−0.9 V vs RHE下,氨的法拉第效率(FENH3)和氨收率高达97.95%和17,637.3 μg h-1 cm-2。此外,Cu3P/CoP对亚硝酸盐还原为氨也具有良好的催化活性,在−0.7 V vs RHE下,FENH3高达98.31%。实验和理论计算表明,Cu3P与CoP之间形成的非均相界面有效地促进了电子转移,其中Cu3P作为电子供体诱导Cu周围的电子密度降低,导致NO2 -吸附增强,从而加速了en3rr过程,抑制了竞争性析氢反应(HER)。此外,金属磷化物催化剂促进了水的解离,加速了丰富的*H生成,从而加强了随后向en3rr加氢的过程。
期刊介绍:
ACS Applied Materials & Interfaces is a leading interdisciplinary journal that brings together chemists, engineers, physicists, and biologists to explore the development and utilization of newly-discovered materials and interfacial processes for specific applications. Our journal has experienced remarkable growth since its establishment in 2009, both in terms of the number of articles published and the impact of the research showcased. We are proud to foster a truly global community, with the majority of published articles originating from outside the United States, reflecting the rapid growth of applied research worldwide.