Cu3P/CoP Heterostructure for Efficient Electrosynthesis of Ammonia from Nitrate Reduction Reaction

IF 8.3 2区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY ACS Applied Materials & Interfaces Pub Date : 2024-12-18 DOI:10.1021/acsami.4c16144
Pengfei Liu, Xuetao Cheng, Huilin Zhao, Fenghua Bai, Yan-Qin Wang
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Abstract

Electrocatalytic nitrate reduction (ENO3RR) for ammonia production is one of the potential alternatives to Haber–Bosch technology for the realization of artificial ammonia synthesis. However, efficient ammonia production remains challenging due to the complex electron transfer process in ENO3RR. In this study, we fabricated a Cu3P/CoP heterostructure on carbon cloth (CC) by electrodeposition and vapor deposition, which exhibits an exceptional ENO3RR performance in alkaline medium, and showcases a Faradaic efficiency of ammonia (FENH3) and an ammonia yield rate as high as 97.95% and 17,637.3 μg h–1 cm–2 at −0.9 V vs RHE. Moreover, Cu3P/CoP also has excellent catalytic activity for nitrite reduction to ammonia, with an FENH3 up to 98.31% at −0.7 V vs RHE. The experimental and theoretical calculations reveal and confirm that the formation of a heterogeneous interface between Cu3P and CoP effectively promotes the electron transfer, where Cu3P as an electron donor induces the decrease of electron density around Cu and results in an enhancement of NO2 adsorption, thereby accelerating the ENO3RR process while inhibiting the competitive hydrogen evolution reaction (HER). Moreover, the metal phosphide catalyst facilitates the water dissociation, which accelerates the abundant *H generation, thus enhancing the subsequent hydrogenation process toward ENO3RR.

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来源期刊
ACS Applied Materials & Interfaces
ACS Applied Materials & Interfaces 工程技术-材料科学:综合
CiteScore
16.00
自引率
6.30%
发文量
4978
审稿时长
1.8 months
期刊介绍: ACS Applied Materials & Interfaces is a leading interdisciplinary journal that brings together chemists, engineers, physicists, and biologists to explore the development and utilization of newly-discovered materials and interfacial processes for specific applications. Our journal has experienced remarkable growth since its establishment in 2009, both in terms of the number of articles published and the impact of the research showcased. We are proud to foster a truly global community, with the majority of published articles originating from outside the United States, reflecting the rapid growth of applied research worldwide.
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