n-Type AlCuFeMn Medium-Entropy Alloy with Reduced Thermal Conductivity: A Prospective Thermoelectric Material

IF 2.5 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Electronic Materials Pub Date : 2024-10-18 DOI:10.1007/s11664-024-11518-7

Palash Swarnakar, Abhigyan Ojha, Partha Sarathi De, Sivaiah Bathula, Amritendu Roy

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Abstract

Developing affordable thermoelectric (TE) materials is critical for efficient waste heat recovery in industries. With the goal of developing novel, affordable TE materials, the present experimental–theoretical investigation, for the first time, presents a rigorous analysis of the electrical and thermal transport properties of a multi-principal-component AlCuFeMn alloy (MPCA). TE properties related to electronic transport, including the Seebeck coefficient, electrical conductivity, and thermal conductivity, were measured on a vacuum-cast sample and were computed using semi-classical Boltzmann transport theory. Additionally, ab initio calculations were performed to calculate the lattice thermal conductivity. The alloy demonstrated overall thermal conductivity of < 4 W/mK, comparable to conventional thermoelectric materials, while the computed lattice thermal conductivity was < 1 W/mK. Such low thermal conductivity may be attributed to the complex microstructure as well as the uniform distribution of aluminium in the matrix. The power factor of the alloy, however, was small (< 0.1 mW/mK²), translating to a low figure of merit (ZT ~ 0.01). Our study indicates that composition engineering can potentially improve the power factor and thus the overall TE response in an AlCuFeMn alloy.

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降低导热系数的n型AlCuFeMn中熵合金：一种有前途的热电材料

开发经济实惠的热电（TE）材料对于工业中有效的废热回收至关重要。为了开发新型、经济实惠的TE材料，本实验-理论研究首次对多主成分AlCuFeMn合金（MPCA）的电和热输运特性进行了严格的分析。在真空铸造样品上测量了与电子输运相关的TE特性，包括塞贝克系数、电导率和导热系数，并使用半经典玻尔兹曼输运理论计算了TE特性。此外，采用从头算法计算了晶格的导热系数。该合金的总热导率为4 W/mK，与传统热电材料相当，而计算的晶格热导率为1 W/mK。这种低导热系数可能归因于复杂的微观结构以及铝在基体中的均匀分布。然而，该合金的功率因数很小（< 0.1 mW/mK2），转化为较低的性能值（ZT ~ 0.01）。我们的研究表明，成分工程可以潜在地提高功率因数，从而提高AlCuFeMn合金的整体TE响应。图形抽象

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来源期刊

Journal of Electronic Materials 工程技术-材料科学：综合

CiteScore

4.10

自引率

4.80%

发文量

693

审稿时长

3.8 months

期刊介绍： The Journal of Electronic Materials (JEM) reports monthly on the science and technology of electronic materials, while examining new applications for semiconductors, magnetic alloys, dielectrics, nanoscale materials, and photonic materials. The journal welcomes articles on methods for preparing and evaluating the chemical, physical, electronic, and optical properties of these materials. Specific areas of interest are materials for state-of-the-art transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications. Review papers on current topics enable individuals in the field of electronics to keep abreast of activities in areas peripheral to their own. JEM also selects papers from conferences such as the Electronic Materials Conference, the U.S. Workshop on the Physics and Chemistry of II-VI Materials, and the International Conference on Thermoelectrics. It benefits both specialists and non-specialists in the electronic materials field. A journal of The Minerals, Metals & Materials Society.