Investigate on the Electromagnetic and Loss Characteristics of NI HTS Multi-Pancake Coil During Charging Process

IF 2.1 3区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Magnetics Pub Date : 2024-12-04 DOI:10.1109/TMAG.2024.3502443
Leiwen Yue;Wenhai Zhou;Rui Liang;Liang Yan;Shijie Shi;Jiafeng Cao
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Abstract

Non-insulated (NI) high-temperature superconducting (HTS) coil has become the core component of superconducting equipment in many high-tech applications because of its excellent electrothermal stability and self-protection characteristics. Due to the absence of turn-to-turn insulation, the electromagnetic behavior of the NI HTS coil during charging is very different from that of a traditional insulated (INS) coil. Many of its problems in engineering applications have not been fully studied. Therefore, the electromagnetic and loss characteristics of the NI HTS multi-pancake coil wound with (RE)Ba2Cu3Ox (REBCO) conductors during the charging process are studied in this article. A lumped equivalent circuit model (LECM) of NI HTS multi-pancake coil is combined with a finite element model (FEM) based on H-formulation. The LECM is used to calculate the current distribution and turn-to-turn loss, and the FEM is used to calculate the magnetization loss of the superconducting layer. The results show that after increasing the difference of the resistance or inductance in the multi-pancake coil, some coils will produce reverse circumferential current and the reflux phenomenon only exists in the early stage of charging. Increasing the number of coil layers will extend the coil charging time. Increasing the charging rate will significantly increase the rising rate and peak value of the coil radial current, making the coil quench risk greater. For the charging loss, the total loss of the multi-pancake coil is several times that of the single-pancake coil. Compared to the INS multi-pancake coil, the NI multi-pancake coil has a smaller magnetization loss rise rate but a larger total charging loss under the same conditions. Therefore, more attention should be paid to the NI multi-pancake coil in the application of superconducting devices.
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NI高温超导多煎饼线圈在充电过程中的电磁特性和损耗特性研究
非绝缘高温超导线圈因其优异的电热稳定性和自保护特性,已成为许多高科技应用中超导设备的核心部件。由于没有匝间绝缘,NI高温超导线圈在充电过程中的电磁行为与传统的绝缘(INS)线圈有很大不同。它在工程应用中的许多问题尚未得到充分的研究。因此,本文研究了(RE)Ba2Cu3Ox (REBCO)导体绕线的NI HTS多煎饼线圈在充电过程中的电磁特性和损耗特性。将NI高温超导多煎饼线圈的集总等效电路模型与基于h -公式的有限元模型相结合。采用LECM计算电流分布和匝间损耗,采用FEM计算超导层的磁化损耗。结果表明:增大多煎饼线圈中电阻或电感的差值后,部分线圈会产生反向周向电流,回流现象只存在于充电初期;增加线圈层数将延长线圈充电时间。增大充电速率会显著提高线圈径向电流的上升速率和峰值,使线圈的猝灭风险增大。对于充电损耗,多煎饼线圈的总损耗是单煎饼线圈的数倍。与INS多煎饼线圈相比,NI多煎饼线圈在相同条件下的磁化损耗上升率较小,但总充电损耗较大。因此,NI多煎饼线圈在超导器件中的应用应受到更多的重视。
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来源期刊
IEEE Transactions on Magnetics
IEEE Transactions on Magnetics 工程技术-工程:电子与电气
CiteScore
4.00
自引率
14.30%
发文量
565
审稿时长
4.1 months
期刊介绍: Science and technology related to the basic physics and engineering of magnetism, magnetic materials, applied magnetics, magnetic devices, and magnetic data storage. The IEEE Transactions on Magnetics publishes scholarly articles of archival value as well as tutorial expositions and critical reviews of classical subjects and topics of current interest.
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2024 Index IEEE Transactions on Magnetics Vol. 60 Introducing IEEE Collabratec Front Cover Table of Contents Member Get-A-Member (MGM) Program
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