Design and Measurement of a Zero-Index Metasurface for Microwave Power Transmission Applications

IF 4.1 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Electron Device Letters Pub Date : 2024-11-25 DOI:10.1109/LED.2024.3505203
Huaiqing Zhang;Zhenteng Fan;Jingjing Yang;Jinpeng He;Hui Xiao
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Abstract

In practical microwave power transmission (MPT) applications, the oblique incident angle always influences the captured power of the moving receiver. To mitigate this issue, a near-zero index metasurface (ZIM) is designed and investigated, the results prove that it can correct the wave vector direction for a wide range of the incident angle, and guarantee all outgoing waves propagate at the same angle (perpendicular to the receiver). Therefore, the harvested power at the receiving terminal can be enhanced in the MPT system. A system-level result indicates that, after loading a designed ZIM in the MPT system, the reception efficiency (RE) increased from 51.6% (without ZIM) to 63.8% at a working frequency of 5.8 GHz. In addition, although the received power inevitably decreases when the incidence angle increases, the fabricated ZIM retains a higher RE of the system than that without it.
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微波功率传输用零折射率超表面的设计与测量
在实际的微波功率传输应用中,斜入射角会影响移动接收机的捕获功率。为了解决这个问题,设计并研究了一种近零折射率超表面(ZIM),结果证明它可以在大范围的入射角范围内校正波矢量方向,并保证所有出射波以相同的角度(垂直于接收器)传播。因此,在MPT系统中,可以提高接收端的收获功率。系统级结果表明,在MPT系统中加载设计的ZIM后,在5.8 GHz工作频率下,接收效率(RE)从未加载ZIM时的51.6%提高到63.8%。此外,虽然随着入射角的增加,接收功率不可避免地会降低,但制造的ZIM保持了比没有它的系统更高的RE。
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来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
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