Improved Wavelength Stability of InGaN-Based Red LEDs Grown on Graphene/SiC Substrates

IF 4.1 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Electron Device Letters Pub Date : 2024-11-13 DOI:10.1109/LED.2024.3496940
Jiaqi Yu;Gaoqiang Deng;Yunfei Niu;Yusen Wang;Haotian Ma;Shixu Yang;Changcai Zuo;Jingkai Zhao;Haozhe Gao;Guoxing Li;Baolin Zhang;Yuantao Zhang
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Abstract

The application of InGaN based red LEDs in Micro LED display has been severely limited due to their low luminous efficiency and poor wavelength stability. In this work, we demonstrate InGaN based red LEDs with improved wavelength stability on SiC substrates. The key of our method is to introduce a graphene intermediate layer between the epitaxial LED structure and SiC substrate. Another important process is to modulate the growth behavior and stress state of the GaN film and LED structure on graphene. This is achieved by optimizing the nitrogen-plasma pre-treatment time of graphene. As a consequence, InGaN based red LEDs with small wavelength shift with the change of driving current are obtained. The wavelength shift is 8 nm as the forward driving current density increase from 1 to 10 A/cm2, which is significantly lower than the 25 nm of the reference red LEDs directly grown on SiC substrates. In addition, we analyse the mechanism responds to the improvements of wavelength stability for the red LEDs grown on graphene/SiC. This work provides a feasible approach for enhancing the wavelength stability of InGaN based red LEDs.
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石墨烯/SiC衬底上生长的ingan基红色led波长稳定性的改善
由于发光效率低、波长稳定性差,InGaN基红色LED在微型LED显示屏中的应用受到了严重限制。在这项工作中,我们展示了基于InGaN的红色led在SiC衬底上具有更好的波长稳定性。该方法的关键是在外延LED结构和SiC衬底之间引入石墨烯中间层。另一个重要的过程是在石墨烯上调节GaN薄膜和LED结构的生长行为和应力状态。这是通过优化石墨烯的氮等离子体预处理时间来实现的。因此,可以获得随驱动电流变化波长位移较小的InGaN基红色led。当正向驱动电流密度从1 A/cm2增加到10 A/cm2时,波长位移为8 nm,明显低于直接生长在SiC衬底上的参考红色led的25 nm。此外,我们还分析了在石墨烯/SiC上生长的红色led波长稳定性提高的响应机制。这项工作为提高InGaN基红色led的波长稳定性提供了一种可行的方法。
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来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
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