Subthreshold Swing Modeling Down to Cryogenic Temperatures for MOSFET Compact Models

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2024-11-26 DOI:10.1109/TED.2024.3499934
Kejun Xia
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Abstract

In this article, we present a method to analytically model the subthreshold swing (SS) in bulk MOSFET compact models down to cryogenic temperatures by incorporating interface states into the surface potential equation (SPE). The impact of the interface states is captured by a gate voltage shift. To derive a close-form solution, the shift is first calculated for the actively charging region of the gate voltage using a linear approximation of the interface states. The shift is then smoothly clamped to zero at lower gate voltages, where the interface states are empty, and to a saturated value at higher gate voltages, where the interface states are fully charged. This approach differs from the empirical or behavioral methods typically used in compact models. The method effectively models the SS and its saturation at cryogenic temperatures and has been validated with measurement data down to 4.2 K in an n-channel Si MOSFET from a 28-nm bulk CMOS process for both linear and saturation regions. This method does not account for the band-tail effect, and self-heating is not considered, as it is negligible in the subthreshold region. The approach is straightforward and can be easily applied to other types of MOSFETs.
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低温下MOSFET紧凑模型的亚阈值摆动建模
在本文中,我们提出了一种方法,通过将界面状态纳入表面势方程(SPE),来解析模拟块体MOSFET紧凑模型中的亚阈值摆动(SS)直至低温。接口状态的影响是通过栅极电压位移捕捉到的。为了推导出闭合解,首先使用界面状态的线性近似计算栅极电压主动充电区域的位移。然后,在较低的门电压下,位移平滑地箝位到零,其中界面状态为空,并在较高的门电压下达到饱和值,其中界面状态充满电。这种方法不同于紧凑模型中通常使用的经验或行为方法。该方法有效地模拟了SS及其在低温下的饱和度,并在28纳米体CMOS工艺的n沟道Si MOSFET中对线性和饱和区域的测量数据低至4.2 K进行了验证。这种方法不考虑带尾效应,也不考虑自热,因为它在阈下区域可以忽略不计。该方法很简单,可以很容易地应用于其他类型的mosfet。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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