Xinyi Huang;Huihui Wang;Laqun Liu;Dagang Liu;Zhijie Li
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引用次数: 0
Abstract
An electromagnetic particle-in-cell (PIC) simulation technique is used to analyze multipactor discharge on a dielectric with a beat wave composed of multiple high-power microwaves (HPMs) with similar frequencies. Unlike the single-frequency HPM, the strength of
${E}_{\text {n}}$
of the multipactor with a beat wave fluctuates greatly with time, resulting in the root-mean-square value of
${E}_{\text {n}}$
(strongly related to the average deposition power) being significantly greater than the absolute value of the arithmetic mean of
${E}_{\text {n}}$
(the traditional indicator of the multipactor strength), where
${E}_{\text {n}}$
is the electric field due to the deposited charges induced by multipactor. In this article, the influence of double-frequency and triple-frequency beat waves on multipactor is studied from the perspective of the root-mean-square value and absolute value of the arithmetic mean of
${E}_{\text {n}}$
. The results show that the strong multipactor with a beat wave is unaffected by the spectra of the beat wave and the beat wave cannot inhibit the strong multipactor strength in contrast to a single-frequency HPM with the same average microwave power while the inhibition effect of a beat wave on a moderated multipactor is obvious. Further analysis shows that the suppression effect of a beat wave on a moderated multipactor is greatest when both the frequencies and phases of the beat wave are arranged in an arithmetic progression and the moderated multipactor can also be suppressed substantially when the amplitudes of the beat wave deviate slightly from the condition of equal amplitude.
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.