Yi Gu;Chengkang Tang;Xianghui Li;Qingqing Sun;David Wei Zhang;Hao Zhu
{"title":"A Structural Impact Study and Process Optimization of FinFET Parasitic Capacitance","authors":"Yi Gu;Chengkang Tang;Xianghui Li;Qingqing Sun;David Wei Zhang;Hao Zhu","doi":"10.1109/TED.2024.3496446","DOIUrl":null,"url":null,"abstract":"While excelling in device density and driving capability, the fin field-effect transistor (FinFET) development has highlighted the increasing impact of parasitic capacitance on high-frequency performance. Here, we report a comprehensive impact study of FinFET structures and key process on the parasitic capacitance, particularly the gate-source/drain (S/D) capacitance (\n<inline-formula> <tex-math>${C} _{\\text {G-SD}}$ </tex-math></inline-formula>\n). By TCAD simulation, the optimal structural parameters of the fin and S/D geometry have been identified with improved dc performance as well as \n<inline-formula> <tex-math>${C} _{\\text {G-SD}}$ </tex-math></inline-formula>\n characteristics. The parasitic \n<inline-formula> <tex-math>${C} _{\\text {G-SD}}$ </tex-math></inline-formula>\n is further suppressed by optimized high-k/metal gate (HKMG) critical process steps. Enhanced ac performance is experimentally achieved realizing over 20% improvement in cutoff frequency (\n<inline-formula> <tex-math>${f} _{\\text {T}}$ </tex-math></inline-formula>\n) and maximum oscillation frequency (\n<inline-formula> <tex-math>${f} _{\\max }$ </tex-math></inline-formula>\n) as compared to baseline (320.4-GHz \n<inline-formula> <tex-math>${f} _{\\text {T}}$ </tex-math></inline-formula>\n and 362.2-GHz \n<inline-formula> <tex-math>${f} _{\\max }$ </tex-math></inline-formula>\n for nMOS and 393-GHz \n<inline-formula> <tex-math>${f} _{\\text {T}}$ </tex-math></inline-formula>\n and 168-GHz \n<inline-formula> <tex-math>${f} _{\\max }$ </tex-math></inline-formula>\n for pMOS). The results demonstrate practical potential in both device-level and circuit-level engineering toward advanced FinFET-based high-frequency applications.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"72 1","pages":"17-23"},"PeriodicalIF":2.9000,"publicationDate":"2024-11-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electron Devices","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10766647/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
While excelling in device density and driving capability, the fin field-effect transistor (FinFET) development has highlighted the increasing impact of parasitic capacitance on high-frequency performance. Here, we report a comprehensive impact study of FinFET structures and key process on the parasitic capacitance, particularly the gate-source/drain (S/D) capacitance (
${C} _{\text {G-SD}}$
). By TCAD simulation, the optimal structural parameters of the fin and S/D geometry have been identified with improved dc performance as well as
${C} _{\text {G-SD}}$
characteristics. The parasitic
${C} _{\text {G-SD}}$
is further suppressed by optimized high-k/metal gate (HKMG) critical process steps. Enhanced ac performance is experimentally achieved realizing over 20% improvement in cutoff frequency (
${f} _{\text {T}}$
) and maximum oscillation frequency (
${f} _{\max }$
) as compared to baseline (320.4-GHz
${f} _{\text {T}}$
and 362.2-GHz
${f} _{\max }$
for nMOS and 393-GHz
${f} _{\text {T}}$
and 168-GHz
${f} _{\max }$
for pMOS). The results demonstrate practical potential in both device-level and circuit-level engineering toward advanced FinFET-based high-frequency applications.
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.